Study on Integrated Thermal Management Devices through the Construction of 3D Microchannel Networks

2023 Fiscal Year Final Research Report

• Project/Area Number: 21K03905
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Review Section: Basic Section 19020:Thermal engineering-related
• Research Institution: National Institute of Advanced Industrial Science and Technology
• Principal Investigator: Baba Soumei 国立研究開発法人産業技術総合研究所, エネルギー・環境領域, 主任研究員 (10711773)
• Project Period (FY): 2021-04-01 – 2024-03-31
• Keywords: 微細加工 / 滴状凝縮 / TSP / 可視化計測 / 伝熱促進 / jumping droplet / マイクロチャネル

Outline of Final Research Achievements

In this study, we developed an integrated thermal control device with a high-density microchannel network using silicon etching technology. Visualization techniques using temperature-sensitive paint (TSP) allowed us to visualize the heat transfer distribution on the heating surface with high temporal and spatial resolution. We also controlled multi-scale condensation phenomena using bio-inspired nano- and microstructured surfaces. These advancements enabled stable boiling without dryout at heat fluxes up to 15 W/cm^2 and provided detailed insights into heat transfer mechanisms during forced convective boiling. Our findings propose a novel approach to enhancing heat exchange processes through precise surface structure adjustments, potentially improving the efficiency of thermal control devices.

Free Research Field

熱工学

Academic Significance and Societal Importance of the Research Achievements

本研究は、シリコンエッチング技術とナノ・マイクロ構造を用いて、効率的な熱制御デバイスの開発を行った。学術的意義としては、沸騰および凝縮現象のメカニズム解明に寄与する基盤的技術として可視化計測と伝熱促進のための微細加工技術の開発を行い、熱伝達率の向上を実証した。社会的意義としては、今後課題となる高性能電子機器の冷却効率向上に寄与し、省エネルギー化と機器寿命の延長への貢献が期待される。