2023 Fiscal Year Final Research Report
Innovative Elucidation in Structural Analysis of Ultrathin Barriers and Control of Copper Interconnect
| Project/Area Number |
21K04150
|
|---|
| Research Category |
Grant-in-Aid for Scientific Research (C)
|
| Allocation Type | Multi-year Fund |
|---|
| Section | 一般 |
|---|
| Review Section |
Basic Section 21050:Electric and electronic materials-related
|
|---|
| Research Institution | Kitami Institute of Technology |
|---|
Principal Investigator |
|
|---|
| Co-Investigator(Kenkyū-buntansha) |
佐藤 勝 北見工業大学, 工学部, 准教授 (10636682)
|
|---|
| Project Period (FY) |
2021-04-01 – 2024-03-31
|
| Keywords | 集積回路 / 銅配線 / 拡散バリヤ / 配向制御 |
|---|
| Outline of Final Research Achievements |
In the field of LSI, there is a strong demand for the fabrication of Cu(111) oriented interconnect, but practical application has been considered difficult because a two-layer structure consisting of a relatively thick underlying material for obtaining Cu(111) orientation and a barrier material for suppressing Cu diffusion, is strongly required. In this study, we demonstrated that Cu(111) orientation can be achieved with only an ultra-thin diffusion barrier of about 5 nm, an excellent result that overturns the conventional wisdom of interconnect structures. Furthermore, this research will have a significant impact on the semiconductor industry, including integrated circuits, because it is extremely useful for improving the performance of next-generation integrated circuits in which new devices will be fabricated on the interconnects.
|
| Free Research Field |
集積回路
|
| Academic Significance and Societal Importance of the Research Achievements |
本研究は、薄膜の初期構造そのものがこれまでの教科書や報告されてきた学術論文ベースのものと異なり、薄膜の初期過程に新たなモードがあることを実験的に実証した点で大いに学術的意義がある。そして、そのことが実験的に実証された点は極めて有益である。さらに、これまで困難とされてきた薄いバリヤ膜の構造解析に成功した点でも学術的意義は大きい。
一方、実用可能なオーダーの薄いバリヤ材料上でCu(111)配向を実現できたことは、集積回路のより一層の発展、さらには近年LSIの配線上に新たなデバイスを構成することが提案されており、それらデバイスの性能向上をも実現できる社会的意義は極めて大きい。
|
