2023 Fiscal Year Final Research Report
Establishment of Fatigue Crack Network Fracture Life Prediction Method for Power Semiconductor Device Die-Attach Joint
| Project/Area Number |
21K04182
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Review Section |
Basic Section 21060:Electron device and electronic equipment-related
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| Research Institution | Shibaura Institute of Technology |
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Principal Investigator |
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| Project Period (FY) |
2021-04-01 – 2024-03-31
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| Keywords | ダイアタッチ / 熱疲労 / パワーサイクル / パワー半導体 / FEM / 寿命予測 |
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| Outline of Final Research Achievements |
High-speed thermal cycling tests were conducted on die attach joints to elucidate the mechanism of fatigue crack network failure in die attach joints. It was clarified that the fatigue crack network is formed by continuous crack initiation due to equibiaxial stress and the propagation and connection of these cracks. The extended volume theory was used to describe the fracture and predict the damage development due to the fatigue crack network formation. Furthermore, a damage development type FEM analysis corresponding to fatigue crack networks was proposed. This method reproduced the damage development specific to fatigue crack network failure. This method can also be applied to crack propagation damage from the periphery of the die attach, and a guideline for establishing a fatigue life prediction method for die attach joints was obtained.
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| Free Research Field |
電子実装
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| Academic Significance and Societal Importance of the Research Achievements |
次世代パワー半導体デバイスダイアタッチ接合部の新たな破壊である疲労き裂ネットワークの機構を解明し，その寿命予測方法を確立した．この寿命予測法は均一応力場でロジスティック曲線型にき裂がランダムに発生し，損傷が発展するという従来にはない新しい手法であり，学術的意義が高いものである．また，このダイアタッチ接合部の疲労き裂ネットワーク破壊の寿命予測が可能となることで，高性能なパワー半導体の開発が進み，エネルギーの効率利用に対して貢献することができる．エネルギーの効率利用は脱炭素社会の実現に不可欠であり，本研究成果は社会的に意義の高いものである．
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