Fabrication of high entropy alloy film by multi pulse electrodeposition and the measurement of corrosion and wear resistance

2023 Fiscal Year Final Research Report

• Project/Area Number: 21K04724
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Review Section: Basic Section 26050:Material processing and microstructure control-related
• Research Institution: Hiroshima Institute of Technology
• Principal Investigator: Wang Rongguang 広島工業大学, 工学部, 教授 (30363021)
• Co-Investigator(Kenkyū-buntansha): 佐藤 裕樹 広島工業大学, 工学部, 教授 (20211948)
• Project Period (FY): 2021-04-01 – 2024-03-31
• Keywords: ハイエントロピー / 電析 / 有機溶媒 / 複雑反応 / 耐食性 / 変形抵抗 / 触媒活性

Outline of Final Research Achievements

The chlorides of Cr, Mn, Fe, Co, and Ni were dissolved in an organic solvent of DMF-CH3CN, in which either constant potential or pulsed potentials were applied on a copper substrate to get electrodeposited thin films. As a result, high-entropy alloy films containing Cr, Mn, Fe, Co, and Ni were obtained on the substrate as long as the applied potential was less noble than -2.0V vs. SSE. The film has an amorphous structure containing some nanocrystals, with complete oxide/hydroxide for Cr and Mn, near all oxide/hydroxide for Fe, half oxide/hydroxide for Co, and little oxide/hydroxide for Ni. The film showed similar hardness, wear resistance, and corrosion resistance with the copper substrate. High electrocatalytic activity in the oxygen evolution reaction was obtained.

Free Research Field

電気化学、表面改質、界面工学

Academic Significance and Societal Importance of the Research Achievements

本研究では、Cr、Mn、Fe、CoまたはNi等の塩化物を有機溶媒に溶かして各種金属元素の電析条件を明確にし、さらに多元素間の共析挙動を解明したことで、ハイエントロピー合金薄膜の電析法による創製に可能性を提供した。今後、元素組合せに無数の合金薄膜の作製が簡単になり、合金開発や材料作成に省資源や軽量化等の目標を達成できる。将来、薄膜合金に秘めた表面機能のみならず、優れたバルク機能をもつ合金の開発も加速できる。