Low temperature bonding using activated transparent thin film in air

2023 Fiscal Year Final Research Report

• Project/Area Number: 21K18729
• Research Category: Grant-in-Aid for Challenging Research (Exploratory)
• Allocation Type: Multi-year Fund
• Review Section: Medium-sized Section 21:Electrical and electronic engineering and related fields
• Research Institution: Kyushu University
• Principal Investigator: Takigawa Ryo 九州大学, システム情報科学研究院, 准教授 (80706846)
• Project Period (FY): 2021-07-09 – 2024-03-31
• Keywords: 大気低温接合 / 光実装・集積

Outline of Final Research Achievements

In this study, Low temperature chip bonding method using activated transparent thin films in air is investigated for heterogeneous optical devices. Formation method of activated transparent thin films is proposed. Findings of both bond characteristics obtained from the vacuum and atmospheric processes is useful for for the mechanism of room temperature bonding and manufacture of future low-cost bonding machines.

Free Research Field

実装・集積・接合

Academic Significance and Societal Importance of the Research Achievements

真空・大気下における接合メカニズムの解明に向けて多くの知見を得ることができたため、本研究成果の学術的な価値は高い。また、将来の大気下室温接合の実現に寄与する可能性があり、簡便な光デバイス製造装置開発に繋がれば産業的にも価値があると考えられる。