2012 Fiscal Year Final Research Report
A binding mechanism between modules for reduction of glue codes
| Project/Area Number |
22500038
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Software
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| Research Institution | Kyoto Sangyo University |
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Principal Investigator |
OGIHARA Takeshi 京都産業大学, コンピュータ理工学部, 教授 (90231224)
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| Project Period (FY) |
2010 – 2012
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| Keywords | ソフトウエア工学 / 組込みソフトウエア |
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| Research Abstract |
In software development with procedural programming languages, routines to connect modules each other (glue codes) are needed. We proposed a new mechanism that could realize the same function as data binding used in object-oriented software developments. It can connect modules each other without glue codes. It is also useful for making module more independent, and for preventing bugs.
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