2012 Fiscal Year Final Research Report
Development of strain measurement system in microscopic area using EBSD method
| Project/Area Number |
22560081
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Okayama University |
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Principal Investigator |
SHIMIZU Kenichi 岡山大学, 大学院・自然科学研究科, 助教 (50294434)
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| Project Period (FY) |
2010 – 2012
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| Keywords | ひずみ / 金属膜材 / EBSD / 疲労 |
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| Research Abstract |
In this study, the pure copper film of 100μm thickness with a 0.5mm notch hole was fatigued and the fatigue damage such as a slip initiation was observed. Moreover, a misorientation and a misorientation axis were computed from crystal orientation matrices obtained by using the EBSD (Electron Backscatter Diffraction) method. As a result, a misorientation angle increased with fatigue testing in almost all the grains of the copper film. In the crystal grain in which slip lines are generated, misorientation axes are inclined to the same direction by fatigue testing, while those turn to a scattering directions for the static loading. From the change of a misorientation axis element, the misorientation axes are inclined toward the transverse direction to the loading direction and in face of the film. Subsequently, the axes tended to the loading direction and the slip lines were initiated.
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[Journal Article] Fatigue Fracture Behavior of MEMS Cu Thin Films2010
Author(s)
Mohamed. K. Hassan*, Tashiyuki Torii, Koki Ishida** and Kenichi Shimizu(*South Valley University, Egypt, **Uchiyama Manufacturing Corp.)
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Journal Title
18th European Conference on Fracture, Fracture of Materials and Structures from Micro to Macro Scale
Pages: 209-216
Peer Reviewed
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