2012 Fiscal Year Final Research Report
All-Wet Chemical Copper Patterning Using Photochemical Reduction
| Project/Area Number |
22560733
|
|---|
| Research Category |
Grant-in-Aid for Scientific Research (C)
|
| Allocation Type | Single-year Grants |
|---|
| Section | 一般 |
|---|
| Research Field |
Material processing/treatments
|
|---|
| Research Institution | Konan University |
|---|
Principal Investigator |
NAWAFUNE Hidemi 甲南大学, フロンティアサイエンス学部, 教授 (60156007)
|
|---|
| Research Collaborator |
AKAMATSU Kensuke 甲南大学, フロンティアサイエンス学部, 教授 (60322202)
TSURUOKA Takaaki 甲南大学, フロンティアサイエンス学部, 講師 (20550239)
ARIMURA Hidetoshi 甲南大学, 大学院・自然科学研究科, 博士
NAKAMICHI Ryota 甲南大学, 大学院・フロンティアサイエンス研究科, 修士課程・生命化学専攻
|
|---|
| Project Period (FY) |
2010 – 2012
|
| Keywords | めっきプロセス / 光触媒 |
|---|
| Research Abstract |
Photochemical deposition of copper thin films was achieved using carboxylic acid as an electron donor for direct fabrication of minute copper circuit patterns on glass substrates. The photochemical reduction of copper ions could occur over the whole surfaces on which UV irradiation area. However, only the copper deposits remained on the surface of hydrophobic n-octadecyltrimethoxysilane patterns after washing with water. It has been determined that the mixed potential theory can be applied to this reaction based on the result of the local polarization curve measurement.
|
