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2011 Fiscal Year Final Research Report

Development of self-propagating exothermic materials and micro-scale casting technique for ecology bonding

Research Project

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Project/Area Number 22656033
Research Category

Grant-in-Aid for Challenging Exploratory Research

Allocation TypeSingle-year Grants
Research Field Materials/Mechanics of materials
Research InstitutionUniversity of Hyogo

Principal Investigator

NAMAZU Takahiro  兵庫県立大学, 大学院・工学研究科, 准教授 (90347526)

Project Period (FY) 2010 – 2011
KeywordsAlNi発熱素材 / ナノ粒子 / 多層膜 / はんだ接着 / 実装 / MEMS
Research Abstract

In this work, we have succeeded in the development of self-propagating exothermic structure. The structure consisted of Ni-coated Al nano-particles. By inducing a small spark at the vicinity of the structure, NiAl intermetallic compound could be produced with exothermic reaction. By using the reaction, SnAg solder film was melted, and solder bonding of Si chips in very short time period could be achieved.

  • Research Products

    (7 results)

All 2011 2010 Other

All Journal Article (2 results) (of which Peer Reviewed: 2 results) Presentation (4 results) Remarks (1 results)

  • [Journal Article] Crack-Less Wafer-Level Packaging Using Flash Heating Technique for Micro Devices2011

    • Author(s)
      T. Namazu, K. Ohtani, K. Yoshiki, and S. Inoue
    • Journal Title

      Materials Science Forum

      Volume: 706-709巻 Pages: 1979-1983

    • DOI

      doi:10.4028/www.scientific.net/MSF.706-709.1979

    • Peer Reviewed
  • [Journal Article] Al/Ni Self-Propagating Exothermic Film for MEMS Application2010

    • Author(s)
      T. Namazu and S. Inoue
    • Journal Title

      Materials Science Forum

      Volume: 638-642巻 Pages: 2142-2147

    • DOI

      doi:10.4028/www.scientific.net/MSF.638-642.2142

    • Peer Reviewed
  • [Presentation] Crack-Less Wafer-Level Packaging Using Flash Heating Technique for Micro Devices2011

    • Author(s)
      T. Namazu, K. Ohtani, K. Yoshiki, and S. Inoue
    • Organizer
      International Conference on Processing & Manufacturing of Advanced Materials
    • Place of Presentation
      カナダ・ケベック
    • Year and Date
      2011-08-04
  • [Presentation] Application of Al/Ni Exothermic Reaction to Sputtering Chamber Cleaning2011

    • Author(s)
      T. Namazu, K. Ohtani, K. Yoshiki, and S. Inoue
    • Organizer
      10th International Symposium on Sputtering & Plasma Process
    • Place of Presentation
      京都リサーチパーク(京都)
    • Year and Date
      2011-07-07
  • [Presentation] Crack Propagation Direction Control of Crack-Less Solder Bonding Using AlNi Flash Heating Technique2011

    • Author(s)
      T. Namazu, K. Ohtani, K. Yoshiki, and S. Inoue
    • Organizer
      16th International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2011
    • Place of Presentation
      中国・北京
    • Year and Date
      2011-06-07
  • [Presentation] Application of Nano-Layered Reactive Film to Silicon Soldering2010

    • Author(s)
      T. Namazu
    • Organizer
      5th International Workshop on Advanced Materials Science and Nanotechnology
    • Place of Presentation
      ベトナム・ハノイ
    • Year and Date
      2010-11-12
  • [Remarks]

    • URL

      http://www.eng.u-hyogo.ac.jp/mse/mse12/index.html

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Published: 2013-07-31  

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