2023 Fiscal Year Final Research Report
Development of vertical wavy structured stretchable microscale interconnects fabricated by micro-corrugation process
| Project/Area Number |
22K20425
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| Research Category |
Grant-in-Aid for Research Activity Start-up
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| Allocation Type | Multi-year Fund |
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| Review Section |
0302:Electrical and electronic engineering and related fields
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| Research Institution | The University of Tokyo |
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Principal Investigator |
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| Project Period (FY) |
2022-08-31 – 2024-03-31
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| Keywords | ストレッチャブルエレクトロニクス / ストレッチャブル配線 / コルゲート加工 / センサ集積化 |
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| Outline of Final Research Achievements |
To realize high-density stretchable interconnects, a new structure of stretchable microscale patterned interconnect, which is formed on a vertical wavy structured metal substrate with an insulating layer, was proposed. To realize the proposed structure, the insulating layer and microscale patterned interconnects were formed on the metal substrate and then micro-corrugated to fabricate a vertical wavy structure. Our proposed process succeeded in fabricating vertical wavy structured interconnects with 100 μm width, and fabricated microscale interconnects sustained a strain of over 50%, and further discussion about the sensor integration was performed.
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| Free Research Field |
実装工学
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| Academic Significance and Societal Importance of the Research Achievements |
本研究では，微細なパターンの形成・パターンのコントロールが難しかった縦波構造型のストレッチャブル配線に対して，数10～数100μm程度の任意形状パターンの形成が可能な新たなプロセスを提案した．今回確立した作製プロセスは，今後のストレッチャブルデバイスにおける高密度集積化に資する期待される．
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