2022 Fiscal Year Annual Research Report
| Project/Area Number |
22F21341
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| Allocation Type | Single-year Grants |
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| Research Institution | National Institute for Materials Science |
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Principal Investigator |
廖 梅勇 国立研究開発法人物質・材料研究機構, 機能性材料研究拠点, 主席研究員 (70528950)
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| Co-Investigator(Kenkyū-buntansha) |
ZHANG ZILONG 国立研究開発法人物質・材料研究機構, 機能性材料研究拠点, 外国人特別研究員
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| Project Period (FY) |
2022-07-27 – 2024-03-31
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| Keywords | ダイヤモンド / MEMS / 磁気センサ |
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| Outline of Annual Research Achievements |
The aim of this project is to develop high-temperature diamond MEMS magnetic sensors that can operate up to 500oC. In this year, to improve the magnetic sensing properties at high temperatures, different interlayers of Ti film, WC film, and WC/Ti film were adopted between the diamond cantilevers and the FeGa thin films in the MEMS magnetic sensors. The thermal-stability of the microstructures, phase structures, and magnetic properties of the FeGa thin films were greatly enhanced by these interlayers. The magnetic sensor with the FeGa/SCD structure has the weakest magnetic sensitivity of 1.96 Hz/mT @573 K and the FeGa/WC/Ti/SCD structure held the highest magnetic sensitivity of 75.40 Hz/mT @673 K. We also developed the on-chip diamond MEMS magnetic sensor up to 773K.
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| Current Status of Research Progress |
Current Status of Research Progress
2: Research has progressed on the whole more than it was originally planned.
Reason
The on-chip diamond MEMS magnetic sensor was developed.
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| Strategy for Future Research Activity |
In the future, we aim to achieve much higher magnetic sensitivity from room temperature to high temperatures. Diamond MEMS magnetic sensor arrays will be developed. To achieve these aims, we will (1) systematically investigate the effect of the quality factor and dimensions of the diamond MEMS resonators on the magnetic sensing performance. (2) An atomic eching process will be adopted to achieve the quality factor over 100,000. (3) The thermal stability with a variation of the quality factor and resonance frequency will be estabilshed. (4) the mechanism of the on-chip actuation and sensing behavior will be studied. (5) Diamond MEMS magnetic sensors of 8x8 array will be developed.
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