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2013 Fiscal Year Annual Research Report

“軟脆”特徴を持つ高機能材料の無欠陥表面創成加工技術と評価技術に関する研究

Research Project

Project/Area Number 23360062
Research InstitutionIbaraki University

Principal Investigator

周 立波  茨城大学, 工学部, 教授 (90235705)

Co-Investigator(Kenkyū-buntansha) 清水 淳  茨城大学, 工学部, 教授 (40292479)
山本 武幸  茨城大学, 工学部, 技術職員 (40396594)
小貫 哲平  茨城大学, 工学部, 准教授 (70400447)
尾嶌 裕隆  茨城大学, 工学部, 講師 (90375361)
Project Period (FY) 2011-04-01 – 2014-03-31
Keywords軟脆材料 / 焦電効果 / 圧電効果 / 研削加工 / 研削熱の影響
Research Abstract

As a typical multi-functional single crystal material, Lithium tantalate (LiTaO3 or LT) exhibits its excellent electro-optical, pyroelectric and piezoelectric properties, and has now been widely applied into many applications, especially in the telecommunication field. However, the most critical issue in the process is its pyroelectric effect and piezoelectric effect which potentially leads to crack initiation during grinding. Because it is rich in plasticity, LT demands larger specific energy for material removal. As the most machining energy is eventually converted into heat, LT undergoes a rapid rise in temperature during the grinding process, thus highly risks in thermal shock. In order to clarify the thermal influence on the grinding process of LiTaO3, the effects of coolant temperature, diamond grinding wheel geometry and material of substrate are investigated in this research. The experimental results show that the increasing rate of grinding torque (or force) and surface roughness are two major factors dominating the crack initiation during grinding of LT wafers. Via a DOE (design of experiment) analysis, coolant temperature and wheel type stand out as the main factors influencing on the increasing rate and wafer surface roughness.

Current Status of Research Progress
Reason

25年度が最終年度であるため、記入しない。

Strategy for Future Research Activity

25年度が最終年度であるため、記入しない。

  • Research Products

    (14 results)

All 2014 2013 Other

All Journal Article (5 results) (of which Peer Reviewed: 5 results) Presentation (8 results) Remarks (1 results)

  • [Journal Article] A Thin Silicon Wafer Thickness Measurement System by Optical Reflectmetry Scheme Using Fourier Transform Near-Infrared Spectrometer2013

    • Author(s)
      Teppei Onuki, Ryusuke Ono, Akira Suzuki, Hirotaka Ojima, Jun Shimizu and Libo Zhou
    • Journal Title

      Advanced Materials Research

      Volume: Vol.797 Pages: 549-554

    • Peer Reviewed
  • [Journal Article] Mirror surface finishing of silicon wafer edge by UF-CMP (ultrasonic assisted fixed-abrasive CMP)2013

    • Author(s)
      Yongbo Wu, Weiping Yang, Mas akazu Fujimoto and Libo Zhou
    • Journal Title

      International Journal of Automation Technology

      Volume: Vol. 7, No. 6 Pages: 663-670

    • Peer Reviewed
  • [Journal Article] Study on the mechanical properties of lithium tantalate and the influence on its machinability2013

    • Author(s)
      Wei Hang, Libo Zhou, Jun Shimizu, Julong Yuan and Takeyuki Yamamoto
    • Journal Title

      International Journal of Automation Technology

      Volume: Vol. 7, No. 6 Pages: 644-653

    • Peer Reviewed
  • [Journal Article] 大口径Siウエハ表面形状の計測評価技術に関する研究-第2報:ウェーブレット変換を用いたノイズ除去手法の適用-2013

    • Author(s)
      尾嶌裕隆,周立波,清水淳
    • Journal Title

      精密工学会誌

      Volume: Vol. 79, No. 7 Pages: 677-681

    • DOI

      10.2493/jjspe.79.677

    • Peer Reviewed
  • [Journal Article] Study on thermal influence of grinding process on LiTaO32013

    • Author(s)
      Wei Hang, Libo Zhou, Jun Shimizu and Julong Yuan
    • Journal Title

      Advanced Materials Research

      Volume: 797 Pages: 252-257

    • DOI

      10.4028/www.scientific.net/AMR.797.252

    • Peer Reviewed
  • [Presentation] 固定砥粒ダイヤモンド砥石構造のモデル化2014

    • Author(s)
      蛯名雄太郎, 周 立波, 清水 淳, 小貫哲平, 尾嶌裕隆
    • Organizer
      2014年度精密工学会春季大会
    • Place of Presentation
      東京
    • Year and Date
      20140318-20140320
  • [Presentation] Three-dimensional cutting edge distribution of abrasives on diamond grinding wheel working surface2013

    • Author(s)
      Libo ZHOU, Yutaro EBINA, Jun SHIMIZU, Teppei ONUKI, Hirotaka OJIMA and Takeyuki YAMAMOTO
    • Organizer
      日本機械学会,6th Int’l Conference on Leading Edge Manufacturing in 21st Century (LEM21)
    • Place of Presentation
      仙台
    • Year and Date
      20131107-20131108
  • [Presentation] Development of fixed diamond abrasive pellet for final finishing of mono-crystallined sapphire wafers2013

    • Author(s)
      Yoshiaki TASHIRO, Libo ZHOU, Jun SHIMIZU, Noriaki SHINODA, Yoshinori MITSUI
    • Organizer
      日本機械学会,6th Int’l Conference on Leading Edge Manufacturing in 21st Century (LEM21)
    • Place of Presentation
      仙台
    • Year and Date
      20131107-20131108
  • [Presentation] 化学作用援用研削の分子動力学シミュレーション-シリコンウエハ-砥粒間の凝着の影響-2013

    • Author(s)
      清水 淳, 周 立波, 山本武幸, 尾嶌裕隆, 小貫哲平, 古牧允彦
    • Organizer
      砥粒加工学会、ABTEC2013
    • Place of Presentation
      東京
    • Year and Date
      20130827-20130829
  • [Presentation] ダイヤモンドペレットによる単結晶サファイアウェーハの平坦加工技術に関する研究 遊離砥粒方式に代替する新たなソリューションの提供2013

    • Author(s)
      田代芳章, 周 立波, 清水 淳, 三井義則, 篠田知顕
    • Organizer
      砥粒加工学会、ABTEC2013
    • Place of Presentation
      東京
    • Year and Date
      20130827-20130829
  • [Presentation] 4H-SiC ウエハの鏡面研削加工技術2013

    • Author(s)
      蛯名雄太郎, 周 立波, 清水 淳, 成田 潔
    • Organizer
      砥粒加工学会、ABTEC2013
    • Place of Presentation
      東京
    • Year and Date
      20130827-20130829
  • [Presentation] 高品位サファイアウエハの研削加工技術2013

    • Author(s)
      蛯名雄太郎, 周立 波, 清水 淳
    • Organizer
      砥粒加工学会、ABTEC2013
    • Place of Presentation
      東京
    • Year and Date
      20130827-20130829
  • [Presentation] 脆性強誘電体材料(LiNbO3)への非熱的レーザアブレーション微細加工技術2013

    • Author(s)
      村山一平, 小貫哲平, 尾嶌裕隆, 清水 淳, 周 立波
    • Organizer
      第14回高エネ研メカ・ワークショップ
    • Place of Presentation
      筑波
    • Year and Date
      20130412-20130412
  • [Remarks] Nano-Engineering Laboratory

    • URL

      https://sites.google.com/site/nlabibarakiuniv/

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Published: 2015-05-28  

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