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2013 Fiscal Year Final Research Report

High Performance, Low Power Hetero-CMOS Device using Compound Si Wafer

Research Project

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Project/Area Number 23360146
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Electron device/Electronic equipment
Research InstitutionTohoku University

Principal Investigator

LEE KANGWOOK  東北大学, 未来科学技術共同研究センター, 教授 (90534503)

Co-Investigator(Kenkyū-buntansha) FUKUSHIMA Takafumi  東北大学, 未来科学技術共同研究センター, 准教授 (10374969)
TANAKA Tetsu  東北大学, 大学院・医工学研究科, 教授 (40417382)
BEA Jichel  東北大学, 未来科学技術共同研究センター, 助教 (40509874)
MURUGESAN Mariappan  東北大学, 未来科学技術共同研究センター, 産学官連携研究員 (10509699)
Co-Investigator(Renkei-kenkyūsha) KOYANAGI Mitsumasa  東北大学, 未来科学技術共同研究センター, 教授 (60205531)
Project Period (FY) 2011-04-01 – 2014-03-31
Keywords複合Siウェハ / ヘテロCMOSトランジスタ / セルフアセンブリー張り合わせ
Research Abstract

We developed new technology for high-performance, low-power hetero-junction CMOS comprising InGaAs NMOS and Ge PMOS on a large-dia. Si wafer. Ge chips and InGaAs chips are precisely (<1um accuracy) and tightly bonded (20MPa) on a smooth surface roughness (Ra 0.5 angstrom) of P-TEOS hydrophilic area on a Si wafer by using self-assembly technology. Shallow p-n junction technologies of ion implantation and annealing condition for hetero-junction CMOS are established. We successfully implemented Ge and InGaAs photodiodes on a Si wafer by using these technologies. This study shows the opportunity to manufacture high-performance, low-power Ge/InGaAs hetero-junction CMOS device on an 8/12 inch Si wafer with low cost.

  • Research Products

    (16 results)

All 2013 2012 2011

All Journal Article (5 results) (of which Peer Reviewed: 5 results) Presentation (11 results)

  • [Journal Article] Die-level 3-D Integration Technology for Rapid Prototyping of High Performance, Multi Functionality Hetero-Integrated Systems2013

    • Author(s)
      Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      IEEE Transactions on Electron Devices

      Volume: vol.60, no.11 Pages: 3842-3848

    • DOI

      10.1109/TED.2013.2280273

    • Peer Reviewed
  • [Journal Article] A Multichip-to-Wafer 3D Integration Technology Using Chip Self-Assembly with Excimer Light Irradiation2012

    • Author(s)
      T. Fukushima, Y. Ohara, M. Murugesan, J.C Bea, K-W. Lee, T. Tanaka, and M. Koyanagi
    • Journal Title

      IEEE Transactions on Electron Devices

      Volume: VOL. 59, NO. 11 Pages: 2956-2963

    • DOI

      10.1109/TED.2012.2212709

    • Peer Reviewed
  • [Journal Article] Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic 3-D LSI2012

    • Author(s)
      Akihiro Noriki, Kang-Wook Lee, Ji-Cheol Bae, Takafumi Fukushima, Tetsu Tanaka and Mitsumasa Koyanagi
    • Journal Title

      IEEE Electron Device Letters

      Volume: vol.33, no. 2 Pages: 221-223

    • DOI

      10.1109/LED.2011.2174608

    • Peer Reviewed
  • [Journal Article] Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing2011

    • Author(s)
      Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY

      Volume: Vol. 1 Pages: 1873-1884

    • DOI

      10.1109/TCPMT.2011.2160266

    • Peer Reviewed
  • [Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011

    • Author(s)
      Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      Micromachins

      Volume: vol.2 Pages: 49-68

    • DOI

      10.3390/mi2010049

    • Peer Reviewed
  • [Presentation] 三次元LSI とヘテロインテグレーション2013

    • Author(s)
      李康旭, 福島誉史, 田中徹, 小柳光正
    • Organizer
      第77回半導体集積回路シンポジウム
    • Place of Presentation
      東京工業大学, Japan
    • Year and Date
      20130711-12
  • [Presentation] 3D Integration Based on Self-Assembly with Electrostatic Temporary Multichip Bonding2013

    • Author(s)
      T. Fukushima, K-W. Lee, T. Tanaka, and M. Koyanagi
    • Organizer
      IEEE Electrical Components Technology Conference (ECTC)
    • Year and Date
      20130528-31
  • [Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012

    • Author(s)
      T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
    • Organizer
      IEEE International Electron Devices Meeting (IEDM)
    • Year and Date
      20121210-12
  • [Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques2012

    • Author(s)
      T. Fukushima, K-W. Lee, J-C. Bea, T. Tanaka, and M. Koyanagi
    • Organizer
      the Electro Chemical Society (ESC) Meeting
    • Year and Date
      20121007-12
  • [Presentation] Development of 3D Integration Technologies and Recent Challenges2012

    • Author(s)
      Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      ADMETA Plus 2012 Advanced Metallization Conference 2012
    • Place of Presentation
      東京
    • Year and Date
      2012-10-23
  • [Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assembly with Cu/Sn Microbump2012

    • Author(s)
      Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      2012 International Conference on Solid State Devices and Materials (SSDM 2012)
    • Place of Presentation
      京都
    • Year and Date
      2012-09-26
  • [Presentation] Self-Assembly-Based 3D Integration Technologies2012

    • Author(s)
      T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
    • Organizer
      2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
    • Place of Presentation
      東京
    • Year and Date
      2012-05-22
  • [Presentation] Wafer-Level 3D Integration Technology Using Self-Assembly2012

    • Author(s)
      Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      MSPNEX (International Micro System Packaging Forum)2012
    • Place of Presentation
      韓国
    • Year and Date
      2012-04-12
  • [Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012

    • Author(s)
      Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      IEEE International 3D System Integration Conference (3DIC) 2011
    • Place of Presentation
      大阪
    • Year and Date
      2012-02-01
  • [Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012

    • Author(s)
      Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      IEEE International 3D System Integration Conference
    • Place of Presentation
      Osaka
    • Year and Date
      2012-02-01
  • [Presentation] Development of Wafer-Level 3D System Integration Technologies2011

    • Author(s)
      T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
    • Organizer
      International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
    • Place of Presentation
      台湾
    • Year and Date
      2011-09-20

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Published: 2015-06-25  

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