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2013 Fiscal Year Final Research Report

Study on GaN-based normally-off device on Si substrate using selective area growth

Research Project

  • PDF
Project/Area Number 23360154
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Electron device/Electronic equipment
Research InstitutionNagoya Institute of Technology

Principal Investigator

EGAWA Takashi  名古屋工業大学, 工学(系)研究科(研究院), 教授 (00232934)

Project Period (FY) 2011-04-01 – 2014-03-31
Keywords有機金属気相成長法 / GaN / 選択再成長 / ノーマリオフ / HEMT
Research Abstract

GaN-based HEMTs have attractive for high power switching applications. Normally-off operation was one of major requirements for AlGaN/GaN HEMTs. However, realization of normally-off operation with high drain cuurent is difficult due to the existence of two-dimensional electron gas in heterointerface induced piezo and spontaneous polarization charges. Selective area growth (SAG) technique is one of solutions for normally-off operation.
In this study, I report normally-off AlGaN/GaN HEMTs with SAG of an AlGaN layer and deposition of an Al2O3 film on an AlGaN/GaN heterostructure designed to be completely depleted. Adopting AlGaN regrowth in a selective area and Al2O3 film deposition for the access region of the HEMT, the normall-off operation of AlGaN/GaN HEMT was demonstrated. The device showed the drain current density of 160 mA/mm and the threshold voltgae of 0.4 V.

  • Research Products

    (25 results)

All 2014 2013 2012 2011 Other

All Journal Article (8 results) (of which Peer Reviewed: 8 results) Presentation (11 results) (of which Invited: 3 results) Book (1 results) Remarks (1 results) Patent(Industrial Property Rights) (4 results)

  • [Journal Article] High Drain Current Density E-Mode Al_2O_3/AlGaN/GaN MOS-HEMT on Si With Enhanced Power Device Figure-of-Merit (4×10^<8> V^<2>Ω^<-1>cm^<-2>)2013

    • Author(s)
      J. J. Freedsman, T. Kubo, T. Egawa
    • Journal Title

      IEEE Transactions on Electron Devices

      Volume: Vol. 60, No. 10 Pages: 3079-3083

    • Peer Reviewed
  • [Journal Article] Origin and Appearance of Defective Pits in the Gate-Drain Region during Reliability Measurements of AlGaN/GaN High-Electron-Mobility Transistors on Si2013

    • Author(s)
      A. F. Wilson, A. Wakejima, T. Egawa
    • Journal Title

      Appl. Phys. Express

      Volume: Vol. 6 Pages: 116601-1-116601-3

    • Peer Reviewed
  • [Journal Article] Influence of GaN Stress on Threshold Voltage Shift in AlGaN/GaN High-Electron-Mobility Transistors on Si under Off-State Electrical Bias2013

    • Author(s)
      A. F. Wilson, A. Wakejima, T. Egawa
    • Journal Title

      Appl. Phys. Express

      Volume: Vol. 6 Pages: 086504-1-086504-4

    • Peer Reviewed
  • [Journal Article] Step-Stress Reliability Studies on AlGaN/GaN High Electron Mobility Transistors on Silicon with Buffer Thickness Dependence2013

    • Author(s)
      A. F. Wilson, A. Wakejima, T. Egawa
    • Journal Title

      Appl. Phys. Express

      Volume: Vol. 6 Pages: 056501-1-056601-3

    • Peer Reviewed
  • [Journal Article] 1.4-kV Breakdown Voltage for AlGaN/GaN High-Electron-Mobility Transistors on Silicon Substrate2012

    • Author(s)
      S. L. Selvaraj, A. Watanabe, A. Wakejima, T. Egawa
    • Journal Title

      IEEE Electron Device Letters

      Volume: Vol. 33, No. 10 Pages: 1375-1377

    • Peer Reviewed
  • [Journal Article] Analyses of hetero-interface trapping properties in AlGaN/GaN high electron mobility transistor heterostructures grown on silicon with thick buffer layers2012

    • Author(s)
      J. J. Freedsman, T. Kubo, T. Egawa
    • Journal Title

      Appl. Phys. Lett

      Volume: Vol. 101 Pages: 013506-1-013506-4

    • Peer Reviewed
  • [Journal Article] Buffer Thickness Contribution to Suppress Vertical Leakage Current With High Breakdown Field (2.3 MV/cm) for GaN on Si2011

    • Author(s)
      I. B. Rowena, S. L. Selvaraj, T. Egawa
    • Journal Title

      IEEE Electron Device Lett

      Volume: Vol. 32, No. 11 Pages: 1534-1536

    • Peer Reviewed
  • [Journal Article] Influence of deep-pits on the device characteristics of metal-organic chemical vapor deposition grown AlGaN/GaN high-electron mobility transistors on silicon substrate2011

    • Author(s)
      S. L. Selvaraj, A. Watanabe, T. Egawa
    • Journal Title

      Appl. Phys. Lett

      Volume: Vol. 98 Pages: 252105-1-252105-3

    • Peer Reviewed
  • [Presentation] Heteroepitaxial Growth and Power Devices Using AlGaN/GaN HEMT on 2000mm Si (111) Substrate2013

    • Author(s)
      T. Egawa
    • Organizer
      35th IEEE Compound Semiconductor IC (CSIC) Symposium
    • Place of Presentation
      モントレー
    • Year and Date
      2013-10-14
    • Invited
  • [Presentation] Electroluminescence under the gate region using AlGaN/GaN HEMT with a transparent gate electrode2013

    • Author(s)
      T. Narita, Y. Fujimoto, A. Wakejima, T. Egawa
    • Organizer
      2013 International Conference on Solid State Devices and Materials (SSDM2013)
    • Place of Presentation
      ヒルトン福岡シーホーク
    • Year and Date
      2013-09-27
  • [Presentation] Demonstration of Enhancement-mode Operation in AlGaN/GaN MOS-HEMT on Si by utilizing ALD Al2O3 layer2013

    • Author(s)
      J. J. Freedsman, T. Kubo, T. Egawa
    • Organizer
      2013 International Conference on Solid State Devices and Materials (SSDM2013)
    • Place of Presentation
      ヒルトン福岡シーホーク,口頭発表
    • Year and Date
      2013-09-25
  • [Presentation] GaN Based MIS-Type HEMT Devices Grown by MOCVD on Si2013

    • Author(s)
      J. J. Freedsman, T. Egawa
    • Organizer
      International Conference on Thin Films & Applications
    • Place of Presentation
      インド
    • Year and Date
      2013-09-13
    • Invited
  • [Presentation] Heteroepitaxial growth and power electronics using AlGaN/GaN HEMT on Si2012

    • Author(s)
      T. Egawa
    • Organizer
      2012 IEEE International Electron Devices Meeting
    • Place of Presentation
      サンフランシスコ
    • Year and Date
      2012-12-12
    • Invited
  • [Presentation] Effect of Buffer Thickness on Degradation of AlGaN/GaN HEMTs on Si2012

    • Author(s)
      W. A. Frank, A. Wakejima, T. Egawa
    • Organizer
      2012 International Conference on Solid State Devices and Materials
    • Place of Presentation
      京都
    • Year and Date
      2012-09-27
  • [Presentation] Investigation of trapping properties in AlGaN/GaN HEMT heterostructures grown on silicon with thick buffer layers2012

    • Author(s)
      J. J. Freedsman, T. Kubo, T. Egawa
    • Organizer
      2012 International Conference on Solid State Devices and Materials
    • Place of Presentation
      京都,ポスター
    • Year and Date
      2012-09-26
  • [Presentation] 1.4 kV Breakdown Voltgae for MOCVD grown AlGaN/GaN HEMTs on Si Substrate2012

    • Author(s)
      S. L. Selvaraj, A. Watanabe, A. Wakejima, T. Egawa
    • Organizer
      Device research conference
    • Place of Presentation
      ペンシルベニア州立大学,ポスター
    • Year and Date
      2012-06-18
  • [Presentation] Deep Pits and Their Influence on the Device Performance for MOCVD Grown AlGaN/GaN HEMTS on Si Substrate2011

    • Author(s)
      S. L. Selvaraj, A, Watanabe, T. Egawa
    • Organizer
      9th International Conference on Nitride Semiconductors ( ICNS-9 )
    • Place of Presentation
      イギリス, グラスゴー
    • Year and Date
      2011-07-13
  • [Presentation] MOCVD grown AlGaN/GaN transistors on Si substrate for High Breakdown Applications2011

    • Author(s)
      S. L. Selvaraj, T. Egawa
    • Organizer
      HeteroSiC-WASMPE 2011 (HeteroSiC-Workshop on Advanced Semiconductor Materials and devices for Power Electronics applications 2011)
    • Place of Presentation
      Toursフランス
    • Year and Date
      2011-06-29
  • [Presentation] Enhanced mobility for MOCVD grown AlGaN/GaN HEMTs on Si substrate2011

    • Author(s)
      S. L. Selvaraj, A. Watanabe, T. Egawa
    • Organizer
      Device research conference
    • Place of Presentation
      カリフォルニア州・サンタバーバラ
    • Year and Date
      2011-06-21
  • [Book] 技術シーズを活用した研究開発テーマの発掘2013

    • Author(s)
      江川孝志, 他
    • Total Pages
      854 (213-222)
    • Publisher
      技術情報協会
  • [Remarks]

    • URL

      http://www.nitech.ac.jp/gene_inf/g60/g60_050/RENDES.html

  • [Patent(Industrial Property Rights)] ドレイン電流密度・相互コンダクタンスを大幅に改善したリセス構造のMIS型ノーマリオフHEMT素子2014

    • Inventor(s)
      江川孝志
    • Industrial Property Rights Holder
      名古屋工業大学, 高橋 実
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      特願2014-067737
    • Filing Date
      2014-03-28
  • [Patent(Industrial Property Rights)] 半導体積層構造およびこれを用いた半導体素子2012

    • Inventor(s)
      江川孝志
    • Industrial Property Rights Holder
      名古屋工業大学, 高橋 実
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      特願2012-162720
    • Filing Date
      2012-07-23
  • [Patent(Industrial Property Rights)] 半導体積層構造およびこれを用いた半導体素子2012

    • Inventor(s)
      江川孝志
    • Industrial Property Rights Holder
      名古屋工業大学, 高橋 実
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      特願2012-135627
    • Filing Date
      2012-06-15
  • [Patent(Industrial Property Rights)] 半導体素子およびその製造方法2012

    • Inventor(s)
      江川孝志, 小田 修
    • Industrial Property Rights Holder
      名古屋工業大学, 高橋 実
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      特願2012-052987
    • Filing Date
      2012-03-09

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Published: 2015-06-25  

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