2013 Fiscal Year Final Research Report
Hybrid Machining by Micro Saw Wire Bonded with Diamond Grains using Metal Solder
| Project/Area Number |
23560113
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Akita University |
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Principal Investigator |
KAMIYA Osamu 秋田大学, 工学(系)研究科(研究院), 教授 (60113891)
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| Project Period (FY) |
2011 – 2013
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| Keywords | ダイヤモンドソーワイヤ / 固定砥粒 / 金属ろう材 / ハイブリッド加工 / 放電加工 / ジェット水流 / 超音波 / ダイヤモンド形状 |
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| Research Abstract |
I studied the effects of the electrical discharge, the water pulsejet and the ultrasonic wave on the cutting processing by using the fixed grain type diamond saw wires of 100-200 micrometers diameter. Moreover, I tried to improve the mechanical properties of diamond saw wire itself. As a result, cutting speed can be improved into about 5 times by the size of a diamond grain being 30 micrometers from 10 micrometers. Furthermore, cutting speed was able to be further raised 30% by adding an ultrasonic wave and carrying out hybrid processing.
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Research Products
(7 results)
