2013 Fiscal Year Final Research Report
Development of functional micro chip-pockets on fine-graded diamond wheel
Project/Area Number |
23560126
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Research Category |
Grant-in-Aid for Scientific Research (C)
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Allocation Type | Multi-year Fund |
Section | 一般 |
Research Field |
Production engineering/Processing studies
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Research Institution | Okayama University |
Principal Investigator |
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Co-Investigator(Kenkyū-buntansha) |
TSUKAMOTO Shinya 岡山大学, 大学院自然科学研究科, 教授 (80163773)
|
Project Period (FY) |
2011 – 2013
|
Keywords | ダイヤモンド砥石 / チップポケット |
Research Abstract |
A regeneration technology of grinding performance of loading fine-graded resinoid bond diamond wheel is developed in this study. In the developed technology, adhesive films are peeled from loading wheel surface to remove loading chips after press films on loading wheel surfaces. Furthermore the dry ice powder blasting achieves the regeneration of grinding performance with more efficiency, too. On the other hand, the coating of fluoroethylene resin on the wheel surface after the regeneration technology of grinding performance doesn't achieve to control wheel loading enough.
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