2013 Fiscal Year Final Research Report
Development of wheel spindle equiped with wheel infeed system
| Project/Area Number |
23560147
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | 防衛大学校(総合教育学群、人文社会科学群、応用科学群、電気情報学群及びシステム工学群) |
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Principal Investigator |
YUI AKINORI 防衛大学校(総合教育学群、人文社会科学群、応用科学群、電気情報学群及びシステム工, その他部局等, 教授 (70532000)
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| Co-Investigator(Kenkyū-buntansha) |
KITAJIMA Takayuki 防衛大学校, システム工学群, 講師 (50546174)
OKAHATA Go 防衛大学校, システム工学群, 助教 (80546169)
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| Project Period (FY) |
2011 – 2013
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| Keywords | 静圧軸受 / リニアアクチュエータ / 大口径シリコンウエハ / 研削盤 / 静電容量式センサ |
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| Research Abstract |
A wheel spindle equipped with both rotary motion and axial infeed motion is developed. Since axial spindle position is monitored by using a capacitance type gap sensor and fed back to the linear actuator, axial spindle position can be precisely controlled even when variety of axial force is loaded during grinding. Due to the radial bearing employed water for working fluid, this system is environmental free. Rotational accuracy of the spindle is 0.23 micrometer, and static stiffness of axial direction was 1060 N/micrometer. As the results, surface roughness of ground silicon wafer, using the grain size of 3000 diamond wheel, was 2nmRa.
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