2013 Fiscal Year Final Research Report
Molecular design of copper Damascene additive which fills via by only one organic additive
| Project/Area Number |
23560872
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Material processing/treatments
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| Research Institution | Osaka Prefecture University |
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Principal Investigator |
KONDO Kazuo 大阪府立大学, 工学(系)研究科(研究院), 教授 (50250478)
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| Project Period (FY) |
2011 – 2013
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| Keywords | めっき / 銅ダマシン / 有機添加剤 / 単一 / ｼﾞｱﾘﾙｱﾐﾝ |
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| Research Abstract |
We have found that instead of the conventional four additive, only one organic additive is effective to fill the via. Electrochemical measurements and QCM explains the filling mechanism. By newly designing the side chain we have foud the new additives. The diallylamine additive is also effective to use as the leveler for the conventional four additive.
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