2013 Fiscal Year Final Research Report

Development of High-Speed Non-Contact Removal Processing Technology of the Brittle Material by Crack Propagation used Shear Stress by Laser

Research Project

Project/Area Number	23560884
Research Category	Grant-in-Aid for Scientific Research (C)
Allocation Type	Multi-year Fund
Section	一般
Research Field	Material processing/treatments
Research Institution	Sasebo National College of Technology
Principal Investigator	MORITA Hidetoshi 佐世保工業高等専門学校, 機械工学科, 准教授 (40332100)
Project Period (FY)	2011 – 2013
Keywords	レーザ加工 / 熱応力加工 / 脆性材料 / き裂進展 / 熱応力
Research Abstract	Now, glass has been used for various industrial products. Industrial fileds call for more efficiency processing method than the conventional method, because it is expected that its materials are used more in the future. Currently glass is processed by grinding wheel. In this method, however, chipping and crack are likely to occur since glass is a hard brittle material. So, there is a limit to the production efficiency of grinding wheel. The authors have found out when the laser is radiated to glass, a mirror surface groove on glass is generated. Then the authors research the new removal processing method using this phenomenon. The method enables to process glass without direct contacts, so this method can solve negative points of grinding wheel. And the production efficiency improves because quantity of removal is large. In this paper, the authors summarize the result of the slicing processing experiment, consideration of crack propagation, and the practical processing method.

(2 results)