2013 Fiscal Year Final Research Report
Development of a PTFE Printed Circuit board that is used in High-Frequency Devices of Terahertz band
| Project/Area Number |
23560888
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Material processing/treatments
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| Research Institution | Hyogo Prefectural Institute of Technology |
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Principal Investigator |
SHIBAHARA Masafumi 兵庫県立工業技術センター, その他部局等, 主席研究員 (80470219)
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| Research Collaborator |
HONDA Kohji (20553085)
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| Project Period (FY) |
2011 – 2013
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| Keywords | 高周波 / プリント回路基板 / PTFEシート / 銅被膜 / 平滑化 / 密着強度 / 大気圧プラズマ / 表面改質 |
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| Research Abstract |
Electroless copper plating on resin substrates has been studied as method for producing flexible printed circuit boards [PCB] . For increased speed of future high-frequency electronics devices, resin substrate having a characteristic of low dielectric loss is necessary. Polytetrafluoroethylene [PTFE] is the most ideal material among resins. However, the adhesion strength between copper layers and PTFE surface is greatly weak, because the PTFE surface is low surface free energy. Therefore, surface modification of PTFE has been required. Furthermore, in order to reduce the signal interconnection delay, it is necessary to keep the smooth PTFE surface.
In this study, we tried to modify the PTFE surface by combination of atmospheric-pressure plasma [APP] treatment and coating formation of surface modification. Then, it was possible to improve the adhesion of PTFE as well as smoothing.
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Research Products
(18 results)
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[Remarks] 柴原正文、フッ素樹脂基板への金属膜被膜に関する研究、平成25年度兵庫県立工業技術センター研究成果発表会、平成25年11月6日、兵庫県民会館
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[Remarks] 柴原正文、フッ素樹脂基板への金属膜被膜に関する研究、産業技術連携推進会議近畿地域部会ナノテクノロジー分科会・次世代ナノテクフォーラム2014、産業技術連携推進会議近畿地域部会、平成26年3月6日、千里ライフサイエンスセンター
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