2012 Fiscal Year Final Research Report
Study on an Intelligent laser slicing method of both hard and brittle materials
| Project/Area Number |
23656095
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Saitama University |
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Principal Investigator |
IKENO Junichi 埼玉大学, 大学院・理工学研究科, 教授 (10184441)
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| Project Period (FY) |
2011 – 2012
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| Keywords | (8)特殊加工 / (9)超精密加工 / (10)ナノマイクロ加工 |
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| Research Abstract |
Micro-crack occur in the inside by a laser penetrates (20%) silicon. If this principle is used, a crack would be made to develop in the flat-shaped inside silicon, and the silicon could be wafering by the crack. It is expected to reduce slicing waste by the new method.The new silicing method is called “Laser slicing". We found out some strong points, for example, forming 3D-structure on sliced surface, slicing waste can reduce to 1/10.
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[Presentation] レーザスライシング法に関する研究2012
Author(s)
関根大輔,大橋一樹,池野順一,澁谷秀雄,松尾利香,篠塚信裕,鈴木秀樹
Organizer
日本機械学会[No.12-11]第9回生産加工・工作機械部門講演会講演論文集
Place of Presentation
秋田県立大学
Year and Date
2012-10-27
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[Presentation]2011
Author(s)
茶花幸一,白石真之,池野順一,松尾利香,鈴木秀樹,国司洋介
Organizer
2011年度砥粒加工学会学術講演会講演論文集,367-368
Place of Presentation
中部大学
Year and Date
2011-09-07
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