Development of fault detection/diagnosis method of multi-layered interconnection in LSI circuit by AFM mechanism

2012 Fiscal Year Final Research Report

• Project/Area Number: 23656101
• Research Category: Grant-in-Aid for Challenging Exploratory Research
• Allocation Type: Multi-year Fund
• Research Field: Production engineering/Processing studies
• Research Institution: Chiba University
• Principal Investigator: MORITA Noboru 千葉大学, 大学院・工学研究科, 教授 (30239660)
• Co-Investigator(Kenkyū-buntansha): HIDAI Hirofumi 千葉大学, 大学院・工学研究科, 准教授 (60313334) ; MATSUSAKA Souta 千葉大学, 大学院・工学研究科, 助教 (30334171)
• Project Period (FY): 2011 – 2012
• Keywords: ナノ / マイクロ加工

Research Abstract

A new fault detection/diagnosis method of multi-layered interconnection in LSI circuit was developed using diamond tools attached on AFM cantilevers. The effects of configuration of a cutting edge and stiffness of a cantilever on removal characteristics of a surface thin layer were investigated. As a result, the removed depth of more than 3.0 μm was achieved by utilizing a high stiffness cantilever. And also, the precise control of applied load to cantilever enabled the observation and evaluation of buried wires at intended removed depth. The present study provides more reliable fault detection/diagnosis method than conventional removal methods such as chemical etching and mechanical polishing.

Research Products

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