2012 Fiscal Year Final Research Report
Interconnect formation for high-band-width packaging
| Project/Area Number |
23656213
|
|---|
| Research Category |
Grant-in-Aid for Challenging Exploratory Research
|
| Allocation Type | Multi-year Fund |
|---|
| Research Field |
Electronic materials/Electric materials
|
|---|
| Research Institution | University of Yamanashi |
|---|
Principal Investigator |
KONDOH Eiichi 山梨大学, 医学工学総合研究部, 教授 (70304871)
|
|---|
| Project Period (FY) |
2011 – 2012
|
| Keywords | 粘菌 / 配線 / 超臨界流体 |
|---|
| Research Abstract |
Bio veins such as amoeboid organism form an efficient network. A high speedelectronic circuit can be fabricated via giving electric conductivity to the bio veins. Inthis work, bio vein surfaces were were metallized using a metal deposition techniquefrom supercritical fluids, where a metal chelate was reduced by hydrogen dissolved inthe fulid. A few of micron-thick Cu or Pt was successfully deposited on non-conductivebio veins without special pretreatment. The tissues did not show a significantdegeneration upto about 200℃.
|
Research Products
(12 results)
