2013 Fiscal Year Final Research Report

Proposal of passive cooling wall using copper foam integrated PCM panel for residences in hot humid region

Research Project

Project/Area Number	23656346
Research Category	Grant-in-Aid for Challenging Exploratory Research
Allocation Type	Multi-year Fund
Research Field	Architectural environment/equipment
Research Institution	Tohoku University
Principal Investigator	YOSHINO Hiroshi 東北大学, 工学(系)研究科(研究院), 名誉教授 (30092373)
Co-Investigator(Kenkyū-buntansha)	TAKAKI Rie 秋田県立大学, システム科学技術学部, 助教 (30466536)
Project Period (FY)	2011 – 2013
Keywords	熱環境
Research Abstract	The purpose of this research is to propose and evaluate passive cooling wall using phase change material for residences in hot humid region. First, we conducted a questionnaire survey and field measurements on residences in Southeast Asia, and revealed their indoor thermal conditions and characteristics of energy consumption. Second, we proposed a passive cooling system that combines phase change material (PCM) with night ventilation. For the proposed system, we also developed a new PCM panel which was integrated with copper foam. We measured its thermal performance by testing with a scale model house. Finally, a heat transfer analysis program was developed for optimal design of the PCM panel and evaluation of its effect on indoor thermal environment.