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2012 Fiscal Year Final Research Report

Room temperature and ambient condition joint materials fabrication with metal nano-inks

Research Project

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Project/Area Number 23656464
Research Category

Grant-in-Aid for Challenging Exploratory Research

Allocation TypeMulti-year Fund
Research Field Material processing/treatments
Research InstitutionOsaka University

Principal Investigator

SUGANUMA Katsuaki  大阪大学, 産業科学研究所, 教授 (10154444)

Project Period (FY) 2011 – 2012
Keywords常温接合 / 拡散接合 / ナノ粒子 / 低エネルギー
Research Abstract

The jointing properties of silver nano-inks at a low or room temperature are investigated using the room temperature sintering and wiring techniques of silver nano-particles. The shear strength and the electrical resistance of the jointing were evaluated as an optimization solvent dispersion of silver nanoparticles and surface state of the substrate. As results of this study, a design guideline of room-temperature jointing was obtained.

  • Research Products

    (12 results)

All 2013 2012 2011 Other

All Journal Article (5 results) (of which Peer Reviewed: 5 results) Presentation (6 results) Book (1 results)

  • [Journal Article] Microstructural stability of Ag sinter joining in thermal cycling2013

    • Author(s)
      Soichi Sakamoto, Tohru Sugahara, Katsuaki Suganuma
    • Journal Title

      Journal of Materials Science: Materials in Electronics

      Volume: 24 Pages: 1332-1340

    • Peer Reviewed
  • [Journal Article] Low-temperature low-pressure die attach with hybrid silver particle paste2012

    • Author(s)
      Katsuaki Suganuma, Soichi Sakamoto, Noriko Kagami, Daisuke Wakuda, Keun-Soo Kim, Masaya Nogi
    • Journal Title

      Microelectronics Reliability

      Volume: 52 Pages: 375-380

    • Peer Reviewed
  • [Journal Article] Stretchable fine fiber with high conductivity fabricated by injection forming2011

    • Author(s)
      Daisuke Wakuda and Katsuaki Suganuma
    • Journal Title

      Applied PhysicsLetters

      Volume: 98 Pages: 073304

    • Peer Reviewed
  • [Journal Article] Low Temperature and Low Pressure Die Bonding Using Thin Ag-flake and Ag-particle Pastes for Power Devices

    • Author(s)
      Soichi Sakamoto, and Katsuaki Suganuma
    • Journal Title

      Transactions on Components, Packaging and Manufacturing Technology

      Volume: (in press)

    • Peer Reviewed
  • [Journal Article] Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices

    • Author(s)
      Soichi Sakamoto, Shijo Nagao, andKatsuaki Suganuma
    • Journal Title

      Journal of Materials Science: Materials in Electronics

    • DOI

      DOI10.1007/s10854-013-1138-x)

    • Peer Reviewed
  • [Presentation] Thermo Mechanical Reliability of Low Energy Ag Die Bonding2012

    • Author(s)
      Tohru Sugahara, Soichi Sakamoto, and Katsuaki Suganuma
    • Organizer
      International Welding / Joining Conference Korea 2012
    • Place of Presentation
      Jeju, Korea
    • Year and Date
      20120508-11
  • [Presentation] Thermo mechanical reliability of low-temperature low-pressure die bonding using thin Ag flake pastes2012

    • Author(s)
      Soichi Sakamoto, and Katsuaki Suganuma
    • Organizer
      2012 7th International Conference on Integrated Power Electronics Systems
    • Place of Presentation
      Nuremberg, Germany
    • Year and Date
      20120306-08
  • [Presentation] Thermo Mechanical Reliability of Low-temperature Low-pressure Die Bonding Using Thin Ag Flake Pastes2012

    • Author(s)
      Soichi Sakamoto, and Katsuaki. Suganuma
    • Organizer
      The 15th SANKEN International Symposium / The 10th SANKEN Nanotechnology Symposium
    • Place of Presentation
      Osaka, Japan
    • Year and Date
      20120112-13
  • [Presentation] Thermomechanical Reliability of Ag Sinter Joining in Thermal Cycling2012

    • Author(s)
      Soichi Sakamoto, Shijo Nagao, Toru Sugahara, and Katsuaki Suganuma
    • Organizer
      8th Handai Nanoscience and Nanotechnology
    • Place of Presentation
      International Symposium, Osaka, Japan
    • Year and Date
      2012-10-11
  • [Presentation] Low temperature die-bonding with Ag flakes2011

    • Author(s)
      Soichi Sakamoto, and Katsuaki. Suganuma
    • Organizer
      European Microelectronics and Packaging Conference 2011
    • Place of Presentation
      Brighton, UK
    • Year and Date
      20110912-15
  • [Presentation] Die bonding materials for low temperature joinning with Ag flakes2011

    • Author(s)
      Soichi Sakamoto, and Katsuaki. Suganuma
    • Organizer
      MES2011
    • Place of Presentation
      Osaka, Japan
    • Year and Date
      20110908-09
  • [Book] 鉛フリーはんだ付け入門2013

    • Author(s)
      菅沼 克昭
    • Publisher
      大阪大学出版会

URL: 

Published: 2014-09-25  

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