2013 Fiscal Year Final Research Report
Vapor-assisted hybrid bonding of organic/inorganic substrates at low temperature and atmospheric pressure
| Project/Area Number |
23686057
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| Research Category |
Grant-in-Aid for Young Scientists (A)
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| Allocation Type | Single-year Grants |
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| Research Field |
Electron device/Electronic equipment
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| Research Institution | National Institute for Materials Science |
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Principal Investigator |
SHIGETOU Akitsu 独立行政法人物質・材料研究機構, 環境・エネルギー材料部門 ハイブリッド材料ユニット, 主任研究員 (70469758)
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| Project Period (FY) |
2011-04-01 – 2014-03-31
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| Keywords | 接合 / 実装 / 低温 / 大気圧 / 異種材料 / ハイブリッド |
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| Research Abstract |
Vapor-assisted hybrid bondings of Cu, Ti, glass, quartz, and polydimethylsiloxane (PDMS) were realized at 150 C and atmospheric pressure. Unlike the conventional Ar fast atom beam bombardment in high vacuum, we utilized the vacuum ultraviolet (VUV) irradiation in the nitrogen gas. We found out that the initial surface contaminants were successfully removed, a part of metal oxide was reduced due probably to the hydrogen radical created from the residual water. For such surfaces, the molecular water was coordinated and created thin bridging layer, where the hydrogen bond contributed to the initial contact between surfaces, followed by the dehydration shrinkage to make the interfacial structure stable. All the starting materials were tightly bonded; in particular, the interface between PDMS substrates indicated considerably small loss of transparency among 380 - 1000 nm. Moreover, this method was applied for the interconnection of ultrathin graphite electrodes.
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Research Products
(35 results)
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[Remarks] ICEP 2013 IEEE CPMT Japan Chapter Young Award, for"VUV/O2 treatment for reduction of Au-Au bonding temperature, Toyama, Japan 2014/04
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[Remarks] Best Poster Conference Paper, IEEE/IOP, for"UV/Vapor-Assisted Hybrid Bonding as a Took for Future Nanopackaing, Birmingham, UK 2012/08
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[Remarks] Best Presentation Award, IEEE CPMT Japan Society, for"Hybrid Solder-Adhesive Bonding Using Simple Resin Planarization Technique for 3D LSI," Planarization Technique for 3D LSI,, Tokyo, Japan, 2012/05
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[Remarks] 異なる材質水で接着, 日刊工業新聞, 012/10/25
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[Remarks] 低温.大気圧下の異種材料接合技術に熱い注目,課題は信頼性評価手法の確立, 日経BP電子版IEEE CPMT ICEP速報記事,2013/04/12
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