2013 Fiscal Year Final Research Report
Fabrication of metal circuit patterns on resins through soft lithography combined with direct metallization process
| Project/Area Number |
23686107
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| Research Category |
Grant-in-Aid for Young Scientists (A)
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| Allocation Type | Single-year Grants |
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| Research Field |
Material processing/treatments
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| Research Institution | Konan University |
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Principal Investigator |
AKAMATSU Kensuke 甲南大学, フロンティアサイエンス学部, 教授 (60322202)
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| Project Period (FY) |
2011-04-01 – 2014-03-31
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| Keywords | ソフトリソグラフィー / めっき / ポリイミド |
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| Research Abstract |
We have succeeded development of fabrication process for polyimide films with embedded metal circuit patterns through combination of soft lithography and direct metallization process. The mechanism of direct metallization process, involving diffusion and reduction of doped metallic ions in polyimide precursors, has been elucidated, and the facile method for metallization of polymer resins by cost-effective, environmentally-friendly chemical process has been developed. In addition, novel processes for fabrication of polymer substrate containing metal nanoparticles and for metallization of polymer substrate through electrochemical constructive lithography have been also successfully developed.
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