Development of Reliability Evaluation Technique for Fatigue Failure in Electronic Packages by Applying Integrated Nondestructive Monitoring Based on Synchrotron Radiation Micro-tomography

2014 Fiscal Year Final Research Report

• Project/Area Number: 24560120
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Materials/Mechanics of materials
• Research Institution: Toyama Industrial Technology Center,
• Principal Investigator: SAYAMA Toshihiko 富山県工業技術センター, 機械電子研究所 機械システム課, 課長 (40416128)
• Co-Investigator(Kenkyū-buntansha): TSURITANI Hiroyuki 富山県工業技術センター, 機械電子研究所機械システム課, 主任研究員 (70416147)
• Co-Investigator(Renkei-kenkyūsha): KENTARO Uesugi 財団法人高輝度光科学研究センター, 利用研究促進部門イメージングチーム, 研究員 (80344399) ; MORI Takao 富山県立大学, 工学部, 教授 (30275078)
• Project Period (FY): 2012-04-01 – 2015-03-31
• Keywords: 信頼性設計 / 高密度実装 / マイクロ接合部 / Ｘ線マイクロＣＴ / 放射光 / はんだ / 熱疲労 / 寿命評価

Outline of Final Research Achievements

In this work, synchrotron radiation laminography technique was firstly applied to the nondestructive observation and evaluation of actual micro-joints on printed circuit boards. The developed technology realized nondestructive monitoring of the joints through the fatigue process, in which the joints deform, the cracks initiate, propagate, and reach to failure, and then led to the integrated estimation of the fatigue lifetime. This result will widely contribute to the improvement of the reliability and the development of electronic equipment.

Free Research Field

工学