Producing high functional resin/metal heterogeneous interface for SiC power devices

2015 Fiscal Year Final Research Report

• Project/Area Number: 24560396
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Electron device/Electronic equipment
• Research Institution: Gunma University
• Principal Investigator: Shohji Ikuo 群馬大学, 大学院理工学府, 教授 (00323329)
• Co-Investigator(Kenkyū-buntansha): KOYAMA Shinji 群馬大学, 大学院理工学府, 助教 (70414109)
• Project Period (FY): 2012-04-01 – 2016-03-31
• Keywords: 電子実装 / パワーモジュール / 樹脂実装 / マイクロ接合 / 機械的特性 / 密着強度 / 界面

Outline of Final Research Achievements

To achieve a high efficiency and high reliability of SiC power module which is expected to be a next generation power module, it is important to achieve high functionality of the resin/metal interface. The aim of this study is to create high-performance heterogeneous interfaces. Mechanical properties which are elastic modulus, tensile strength, fracture strain, fatigue properties and viscoelastic properties of cured thin-film of resin have been investigated. The effects of additives such as SiO2 filler and coupling agent on the mechanical properties have been also investigated. In addition, adhesive strength of a resin/copper interface and its degradation behaviors under high temperature and high-humidity/temperature conditions have been investigated. The results indicate that the preservation of coupling effect at high temperatures is effective to inhibit the degradation of the adhesive strength.

Free Research Field

金属組織学