2013 Fiscal Year Final Research Report

Development of a Wiring Board Having Micro Heat Pipes by MEMS/NEMS Technology

Research Project

Project/Area Number	24760171
Research Category	Grant-in-Aid for Young Scientists (B)
Allocation Type	Multi-year Fund
Research Field	Thermal engineering
Research Institution	Kumamoto University
Principal Investigator	KOITO Yasushi 熊本大学, 自然科学研究科, 准教授 (70347003)
Project Period (FY)	2012-04-01 – 2014-03-31
Keywords	ヒートパイプ / 熱サイフォン / 熱輸送機器 / 伝熱促進 / サーマルマネージメント / 電子機器冷却 / 電子基板 / 複合基板
Research Abstract	In order to develop a wiring board having micro heat pipes, a thermosyphon, a capillary-wick and an oscillation heat pipes are fabricated on a surface of a plastic board, and their heat transfer characteristics are investigated by experiments. In experiments, the phenomena inside the heat pipe are observed and the transient variation of temperatures is measured. Moreover, the effective thermal conductivity of the heat pipe is evaluated. From the experimental results, the effectiveness of the phase-change heat transfer inside the plastic board is confirmed.