Microjoining technology using sintering process of 3D nanoporous structure

2015 Fiscal Year Final Research Report

• Project/Area Number: 25289241
• Research Category: Grant-in-Aid for Scientific Research (B)
• Allocation Type: Partial Multi-year Fund
• Section: 一般
• Research Field: Composite materials/Surface and interface engineering
• Research Institution: Osaka University
• Principal Investigator: Hiroshi Nishikawa 大阪大学, 接合科学研究所, 准教授 (90346180)
• Co-Investigator(Kenkyū-buntansha): SAITO Mikiko 早稲田大学, ナノ・ライフ創新研究機構, 教授 (80386739) ; MIZUNO Jun 早稲田大学, ナノ・ライフ創新研究機構, 教授 (60386737)
• Project Period (FY): 2013-04-01 – 2016-03-31
• Keywords: 高温はんだ代替接合 / 鉛フリー接合 / 低温焼結型接合 / ナノポーラス材料

Outline of Final Research Achievements

The SiC power devices provide the possibility to develop the next-generation power conversion circuit with high efficiency and high power density. To assemble these power devices, the high temperature packaging technology such as die attach process is needed. As a die attach material, we focus on nanoporous metals that are fabricated through the dealloying method and propose nanoporous bonding (NPB) without solvent and organic substance. As a results, the joints bonded at 350 ℃ showed a high shear strength of above 20 MPa. The shear strength of the joint after isothermal aging at 250 ℃ for 1000 h was more than 25 MPa. It was found that joining using Au NPB was successfully achieved, and that NPB shows potential as a Pb-free interconnection material for high-temperature electronic applications.

Free Research Field

エレクトロニクス実装