New Network Polymers Using Low Temperature Curable Novel Thermosetting Imide Compound

2016 Fiscal Year Final Research Report

• Project/Area Number: 25410234
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Polymer/Textile materials
• Research Institution: Osaka Municipal Technical Research Institute
• Principal Investigator: Kimura Hajime 地方独立行政法人大阪市立工業研究所, 有機材料研究部, 研究主任 (60416287)
• Research Collaborator: Ishida Yuichi 宇宙航空研究開発機構
• Project Period (FY): 2013-04-01 – 2017-03-31
• Keywords: 熱硬化性イミド / フェニルエチニル

Outline of Final Research Achievements

A novel thermosetting imide compound having a respective phenylethynyl carbonyl group at both terminal ends was newly synthesized from an acid anhydride having a phenylethynyl carbonyl group and various diamine compounds. The thermosetting behavior of the obtained novel thermosetting imide compound having phenylethynyl carbonyl groups was analyzed through differential scanning calorimetry measurements and infrared spectroscopic analysis. As a result, it became clear that a curing reaction of phenylethynyl carbonyl groups proceeds at approximately 200C, and that the curing reaction thereof proceeds at a temperature that is lower by 150C or more compared to that of phenylethynyl groups. Moreover, a network polymer obtained from a thermosetting imide compound having respective phenylethynyl carbonyl groups at both terminal ends exhibited extremely superior heat resistance and thermal decomposition resistance.

Free Research Field

熱硬化性樹脂