Development of low-temperature curable high heat resistant polymer composite material with low thermal expansion and toughnes

2016 Fiscal Year Final Research Report

• Project/Area Number: 25420748
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Composite materials/Surface and interface engineering
• Research Institution: Osaka Municipal Technical Research Institute
• Principal Investigator: OHTSUKA Keiko 地方独立行政法人大阪市立工業研究所, 有機材料研究部, 研究主幹 (50416286)
• Project Period (FY): 2013-04-01 – 2017-03-31
• Keywords: ネットワークポリマー / 熱硬化性樹脂 / ビスマレイミド樹脂 / 高耐熱性 / 低熱膨張性 / 強靭性

Outline of Final Research Achievements

Bismaleimide resin, which is expected as a next-generation semiconductor power device packaging material, has high heat resistance and low thermal expansion, but it has a disadvantage of being hard and brittle. In this study, the relationship between primary structure, compounding condition, curing condition and heat resistance, thermal expansion property, toughness of a polymer alloy based on bismaleimide resin was clarified. Based on the obtained knowledge, a polymer alloy based on bismaleimide resin having a lowest thermal expansion property, toughness and high heat resistance at a maximum curing temperature of 200℃ was found. In addition, it was shown that a polymer alloy based on bismaleimide resin modified with a polythiol having thiol group reacting with maleimide group and allyl group, and long chain aliphatic unit in the side chain showed excellent low thermal expansion property, toughness and high heat resistance.

Free Research Field

高分子化学