Development of high-efficiency polishing process of the diamond substrate for next-generation power devices

2014 Fiscal Year Final Research Report

• Project/Area Number: 25630029
• Research Category: Grant-in-Aid for Challenging Exploratory Research
• Allocation Type: Multi-year Fund
• Research Field: Production engineering/Processing studies
• Research Institution: Kumamoto University
• Principal Investigator: KUBOTA Akihisa 熊本大学, 自然科学研究科, 准教授 (80404325)
• Project Period (FY): 2013-04-01 – 2015-03-31
• Keywords: ダイヤモンド / 精密研磨 / 紫外光援用研磨

Outline of Final Research Achievements

Diamond substrate has excellent physical properties, attracts attention as a material for the next-generation semiconductor devices. However, diamond substrate is hard to machine because it possess the high-hardness and high chemical inertness. Processing techniques of high removal efficiency and damage-free surface are required in recent years. In this study, we have proposed a novel polishing technique combined with ultraviolet (UV) irradiation utilizing a metal-oxide plate. In this study, while clarifying the processing characteristics of the diamond by the proposed method, we have found the possibility of precision polishing of diamond substrate with high efficiency and high precision at the same time.

Free Research Field

精密加工