On machine wide area thickness measurement technology for wafer thinning process development

2015 Fiscal Year Final Research Report

• Project/Area Number: 25709005
• Research Category: Grant-in-Aid for Young Scientists (A)
• Allocation Type: Partial Multi-year Fund
• Research Field: Production engineering/Processing studies
• Research Institution: Ibaraki University
• Principal Investigator: Onuki Teppei 茨城大学, 工学部, 准教授 (70400447)
• Research Collaborator: Zhou Libo 茨城大学, 工学部, 教授 (90235705) ; Shimizu Jun 茨城大学, 工学部, 教授 (40292479) ; Ojima Hirotaka 茨城大学, 工学部, 准教授 (90375361) ; Yamamoto Takeyuki 茨城大学, 工学部, 技術職員 (40396594)
• Project Period (FY): 2013-04-01 – 2016-03-31
• Keywords: ウェハ薄片化 / 厚さ計測 / 画像計測 / 干渉計 / 分光

Outline of Final Research Achievements

Optical thickness measurement technologies for next generation of wafer thinning process are developed, for (1)optimized measurement range (whole range from initial to destination thickness), high precision (evaluations of tolerance and thickness variation within 0.1 micron order precision), precision assurance (calibration techniques and analysis of error characteristics), (2)wide area imaging thickness measurement techniques, and (3) on-machine and in-process measurements for process control.

Free Research Field

光計測