2014 Fiscal Year Final Research Report
Understand the mechanism and development of metal composite DLC films for high heat resistance utilizing dual-plasma
| Project/Area Number |
25820014
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Kanazawa Institute of Technology |
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Principal Investigator |
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| Project Period (FY) |
2013-04-01 – 2015-03-31
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| Keywords | 高耐熱性 / DLC膜 / 摩擦係数 / 膜硬度 / Si添加率 |
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| Outline of Final Research Achievements |
The heat-resistance of a DLC film was about 400 oC, and it was been pointing out lower than the temperature of the other hard coating films. Therefore the application field was restricted by the temperature even though a DLC films has excellent mechanical properties. On the other hand, an author has found that a heat-resistance can be improved by adding Si to a DLC film. In this study, the Si added DLC films which can maintain at conventional mechanical properties of DLC film under condition of temperature at 650 oC or above is developed. As a results, an author clarified that the Si addition DLC films can be realized of high heat-resistance of 600 oC by addition of a small amount of Si, and that the heat-resistance can be shown only at a range of 10-12.5 at.% of Si dopant ratio.
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| Free Research Field |
プラズマ工学
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