A Green Microarchitecure in 5.5D-Design Era

2016 Fiscal Year Final Research Report

• Project/Area Number: 26280011
• Research Category: Grant-in-Aid for Scientific Research (B)
• Allocation Type: Partial Multi-year Fund
• Section: 一般
• Research Field: Computer system
• Research Institution: Tohoku University
• Principal Investigator: EGAWA RYUSUKE 東北大学, サイバーサイエンスセンター, 准教授 (80374990)
• Co-Investigator(Kenkyū-buntansha): 多田 十兵衛 山形大学, 理工学研究科, 助教 (30361273)
• Co-Investigator(Renkei-kenkyūsha): Kobayashi Hiroaki 東北大学, 情報科学研究科, 教授 (40205480) ; Takizawa Hiroyuki 東北大学, サイバーサイエンスセンター, 教授 (70323996) ; Sato Masayuki 東北大学, 情報科学研究科, 助教 (50781308)
• Research Collaborator: Uno Wataru ; Nishimura Shin ; Hosokawa Mikio ; Toyoshima Takuya
• Project Period (FY): 2014-04-01 – 2017-03-31
• Keywords: TSV / 低消費電力 / 3次元積層

Outline of Final Research Achievements

To clarify the design space of future microprocessors after the end of moor’s law, this research project focuses on vertical integration technologies such as 2.5D and 3D technologies using a through silicon via (TSV). Since the TSVs have a high potential of shortening the latency and reducing the power consumption in/of microprocessors and computing systems, these technologies are expected to overcome the limits of technology scaling. In this research, we explore the design space of the future microprocessors by aggressively using TSVs in various stacking granularities. The evaluation results show that appropriate usage of TSVs with considering a trade-off among performance, power, and cost can drastically improve the energy efficiency of the microprocessors and computer systems.

Free Research Field

計算機アーキテクチャ，高性能計算