Development of novel methodology for construction of adhesive metal/polymer junctions and fabrication of metal circuit patterns by electrochemical lithography

2016 Fiscal Year Final Research Report

• Project/Area Number: 26289277
• Research Category: Grant-in-Aid for Scientific Research (B)
• Allocation Type: Partial Multi-year Fund
• Section: 一般
• Research Field: Material processing/Microstructural control engineering
• Research Institution: Konan University
• Principal Investigator: AKAMATSU KENSUKE 甲南大学, フロンティアサイエンス学部, 教授 (60322202)
• Project Period (FY): 2014-04-01 – 2017-03-31
• Keywords: ダイレクトめっき / ポリイミド / 電気化学リソグラフィー

Outline of Final Research Achievements

In this research project, novel concept to ensure metal/polymer interconnection and methodology for direct fabrication of metal circuit patterns on flexibe polymer substrate have been developed, based on electrochemica deposition techniques applied for insulating polymer substrates. The following results have been ontained: (1) elucidation of deposition mechanism for metal thin films through solid-state electrochemical reaction, (2) clarification of relationship between interfacial nanostructures and adhesion of metal and polymer substrate, and (3) development of patterning process for fabrication of fine circuit patterns. We have succeeded for development of cost-effective, environmentally-friendly , and high-throughput process for next generation superfine circuits on flexible polymer substrate, for which can be applied for next liquid crystal displays and electronic paper applications.

Free Research Field

材料化学