New Removal processing technology of Brittle materials using a tensile stress generated in the vicinity of rapidly heated region by laser

2016 Fiscal Year Final Research Report

• Project/Area Number: 26420067
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Production engineering/Processing studies
• Research Institution: Sasebo National College of Technology
• Principal Investigator: MORITA Hidetoshi 佐世保工業高等専門学校, 機械工学科, 准教授 (40332100)
• Project Period (FY): 2014-04-01 – 2017-03-31
• Keywords: レーザ加工 / 熱応力加工 / 脆性材料 / 応力拡大係数 / 非接触加工 / 除去加工

Outline of Final Research Achievements

When the laser is scanned on the glass surface under certain conditions, there is a phenomenon that mirror surface grooves and curled glass pieces are generated on the glass substrate. This phenomenon is thought to occur by the horizontal crack progressed using thermal stress by laser. In this research, we clarify the mechanism of this phenomenon and aim to develop new removal processing technology of brittle material. In this research period, first, we experiment a processing to apply this phenomenon to a glass surface narrower than the laser heating area, and measure the crack depth and tip position. Then, we compared the distribution of stress intensity factors obtained by FEM analysis and experimental results. And, this mechanism was discussed from these results. Finally, the optimal shape and minimum dimensions of the initial crack were predicted from the stress intensity factor.

Free Research Field

レーザ加工