Development of hard and brittle wafer-grinding machine equipped with vibration assisted spindle system

2017 Fiscal Year Final Research Report

• Project/Area Number: 26420069
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Production engineering/Processing studies
• Research Institution: 防衛大学校(総合教育学群、人文社会科学群、応用科学群、電気情報学群及びシステム工学群)
• Principal Investigator: Yui Akinori 防衛大学校(総合教育学群、人文社会科学群、応用科学群、電気情報学群及びシステム工学群), システム工学群, 教授 (70532000)
• Co-Investigator(Kenkyū-buntansha): 北嶋 孝之 防衛大学校(総合教育学群、人文社会科学群、応用科学群、電気情報学群及びシステム工学群), システム工学群, 准教授 (50546174)
• Research Collaborator: Slocum A.H. マサチューセッツ工科大学, 教授 ; Lu X-D. ブリティッシュコロンビア大学, 准教授 ; KUSUYAMA JUNPEI 防衛大学校
• Project Period (FY): 2014-04-01 – 2018-03-31
• Keywords: 研削 / 振動 / サファイア / ウエハ / 加工時間 / 研削比 / 表面性状 / ロータリ研削盤

Outline of Final Research Achievements

Consumption of sapphire wafer has been expanding for LED board and/or power device. Due to the excellent mechanical properties, sapphire wafer is hard to grinding. On the other hand, ultrasonic assisted grinding applies to machining of difficult to grind materials and shows the effect of high-efficiency machining. However, because the cup grinding wheel is heavy, it cannot be applied to ultrasonic grinding. The authors, developed a grinding wheel vibration system and applied infeed surface grinding of sapphire and silicon wafer. Although, high efficiency grinding could be realized for sapphire wafer, it cannot realized for silicon wafer.

Free Research Field

工学