Develpoment of lead free solder alloy by composite techinology and its prediction of electrical and thermai conductivity

2016 Fiscal Year Final Research Report

• Project/Area Number: 26420740
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Material processing/Microstructural control engineering
• Research Institution: Hiroshima University
• Principal Investigator: Sasaki Gen 広島大学, 工学研究院, 教授 (30192595)
• Project Period (FY): 2014-04-01 – 2017-03-31
• Keywords: 高温鉛フリーはんだ / 複合材料 / 微細組織 / 機械的性質 / 熱伝導性 / 電気伝導性 / 濡れ性

Outline of Final Research Achievements

In order develop the high temperature solder composites, Zn-10Al-2Sn matrix alloy was suggested by using theoretical method, which is expected to have high strength. Then, stainless steel fiber reinforced Zn-10Al-2Sn alloy composites was fabricated by using stir-casting method. The tensile strength was improved as 1.5 times. And, the coefficient of thermal expansion of the composites was controlled as similar value of Pb-Sn alloy. On the other hand, the wettability and the reactivity was estimated by using graphite sheet with (002) surface structure, Zn-10Al-2Sn alloy and (0.3-0.5) Cu-Bi alloy. As a result, this graphite and these alloys had low wettability. But by Ni coating on graphite improve the wettability dramatically.
Furthermore, the theory and the simulation for the prediction of electrical and thermal conductivity of the composites was developed has good agreement with experimental result quantitatively

Free Research Field

機械材料