Development of Wireless MEMS Temperature Sensor Using Magnetic Coupling

2015 Fiscal Year Final Research Report

• Project/Area Number: 26630060
• Research Category: Grant-in-Aid for Challenging Exploratory Research
• Allocation Type: Multi-year Fund
• Research Field: Thermal engineering
• Research Institution: The University of Tokyo
• Principal Investigator: Suzuki Yuji 東京大学, 工学(系)研究科(研究院), 教授 (80222066)
• Project Period (FY): 2014-04-01 – 2016-03-31
• Keywords: 温度センサ / 燃焼 / 電磁結合 / ＬＣＲ回路 / 共振周波数 / フレキシブルプリント基板

Outline of Final Research Achievements

We propose a novel flexible wireless temperature sensor, whose temperature measuring spot is 1 mm squared. The sensor basically consists of LCR resonant circuit and its coil is inductively coupled with an external read-out coil to measure the impedance. The sensor is fabricated on a both-side copper thin film laminated polyimide film and the temperature measuring part is formed with MEMS (Micro Electro Mechanical Systems) process. It is shown in the experiments that the monotonous increase of the resonant frequency due to the increase of the temperature in the range of 25 to 200 °C. In addition, By decreasing the number of frequency sweeping points, the measurement time interval is reduced to ms order with the expense of increasing error in the resonant frequency. The performance of the sensor is evaluated in an unsteady thermal field. The temperature data converted from the measured resonant frequency shows the uncertainty of ±6.4 °C with the average time interval of 2.48 ms.

Free Research Field

熱流体工学