Development of novel electronic device packaging using hybrid resin sheet containing solder particles

2015 Fiscal Year Final Research Report

• Project/Area Number: 26630158
• Research Category: Grant-in-Aid for Challenging Exploratory Research
• Allocation Type: Multi-year Fund
• Research Field: Electron device/Electronic equipment
• Research Institution: Osaka University
• Principal Investigator: FUJIMOTO Kozo 大阪大学, 工学(系)研究科(研究院), 教授 (70135664)
• Co-Investigator(Kenkyū-buntansha): FUKUMOTO SHINJI 大阪大学, 大学院工学研究科, 准教授 (60275310) ; MATSUSHIMA MICHIYA 大阪大学, 大学院工学研究科, 助教 (90403154)
• Project Period (FY): 2014-04-01 – 2016-03-31
• Keywords: 電子デバイス実装 / 熱硬化性樹脂 / 熱可塑性樹脂 / 樹脂硬化 / 粘度 / ぬれ / 気泡 / ボイド

Outline of Final Research Achievements

In this research, a novel chip surface mounting process using thermoset/thermoplastic hybrid resin sheet has been developed to overcome downsizing and to shorten the underfill application process. Hybrid resin sheet have a layered structure that thermoplastic resin films sandwich a thermoset epoxy resin containing self-organizable solder particles. The molten solder particles coalesce spontaneously in the highly fluid thermoset resin at elevated temperature, and at the same time, they get wet to Cu on the substrate through the thermoplastic resin film to form conductive path.
In this work, wetting phenomenon of solder particles in thermoset resin onto Cu through the thermoplastic resin has been clarified. Moreover, mechanism of voids formation in cured resin was investigated. The voids was formed due to gas evolution from thermoset resin. It is necessary to keep the viscosity of thermoset resin lower than the critical value at the melting point of solder to reduce residual voids.

Free Research Field

電子システムインテグレーション