1988 Fiscal Year Final Research Report Summary

Measurement of Grinding Temperature of Ceramics

Research Project

Project/Area Number	61550095
Research Category	Grant-in-Aid for General Scientific Research (C)
Allocation Type	Single-year Grants
Research Field	機械工作
Research Institution	Kanazawa University (1988) Osaka University (1986-1987)
Principal Investigator	TAKASHI Ueda Kanazawa University, Faculty of Engineering, Associate Professor, 工学部, 助教授 (60115996)
Project Period (FY)	1986 – 1988
Keywords	Ceramics / Grinding Temperature / Optical Fiber / 赤外線輻射温度計
Research Abstract	Heat gqnerated in the contact area between a diamond wheel and a ceramic is a main cause of the deterioration in the finished surface of the ceramic and the decrease of the lifetime of the diamond wheel. The temperature at the cutting point is a significant factor in any examination of the cutting mechanism of diamond grains in ceramic grinding. In this study, the temperature of the working grains on the diamond wheel just after cutting and the heat pulses produced by cutting grains in the surface layer of a ceramic are measured using an infrared radiation pyrometer, with the radiation transmitted through an optical fiber. The ceramics used as a workpiece are Si_3N_4 and SiC. The maximum temperature at 40 depth below the ground surface is approximately 500゜C, which is much smaller than that of the carbon steel. Since the conductivity of the ceramic is very small. The temperature of the working grains on a diamond wheel is greater than 1200゜C.