1989 Fiscal Year Final Research Report Summary
A NEW SHAPE MEMORY ALLOY FOR HIGH TEMPERATURE USE WITH HIGH STRENGTH
| Project/Area Number |
62045041
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| Research Category |
Grant-in-Aid for Overseas Scientific Survey.
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| Allocation Type | Single-year Grants |
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| Section | University-to-University Cooperative Research |
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| Research Institution | KANSAI UNIVERSITY |
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Principal Investigator |
SUGIMOTO Koichi KANSAI UNIVERSITY, FACULTY OF ENGINEERING, 工学部, 教授 (00029844)
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| Co-Investigator(Kenkyū-buntansha) |
PATRICK Wollants KATHOLIEKE UNIVERSITEIT LEUVEN, FAC. OF ENG., 工学部, 講師
AERNOUDT Etienne KATHOLIEKE UNIVERSITEIT LEUVEN, FAC. OF ENG. PROFESSOR, 工学部, 教授
DELAEY Luc KATHOLIEKE UNIVERSITEIT LEUVEN, FAC. OF ENG. PROFESSOR, 工学部, 教授
AKAMATSU Katsuya KANSAI UNIVERSITY, FAC. OF ENG. PROFESSOR, 工学部, 教授 (70067643)
KAMEI Kiyoshi KANSAI UNIVERSITY, FAC. OF ENG. PROFESSOR, 工学部, 教授 (70067411)
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| Project Period (FY) |
1987 – 1989
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| Keywords | Copper-based Shape Memory Alloys / Parent Phase / Martesnite / Grain-refining / Titanium / Manganese / Thermal Stability / workability |
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| Research Abstract |
The content of aluminium in a Cu-14%Al-3Ni shape memory alloy was reduced to 11.88% in order to improve the hot workability. It was due to the suppresion of the precipitates of the brittle gamma 2 phase. To avoid the resulting increase in temperature of the martensitic transformation M_s, 5% Ni and 2% Mn were added. An M_s value of about 125 C was thus obtained. The final composition of the new alloy was 11.88% Al, 5.06% Ni, 2.01% Mn, 1.01% Ti, and rest Cu. The tensile strength and the thermal stability of the alloy were shown to be much superior than those in the conventional Cu-Zn-Al alloys previously used. The application of the new alloy, however, seemed to be still considerably difficult due maily to the lack of the cold workability. The improvement of the cold workability, therefore, will be an important key for accelerating the application of this new type of shape memory alloy for high temperature use with high strength in the future.
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