1988 Fiscal Year Final Research Report Summary
Analysis of Conformation and Physical Properties for New Complex-Adhesives
| Project/Area Number |
62560172
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| Research Category |
Grant-in-Aid for General Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Research Field |
林産学
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| Research Institution | Shizuoka University |
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Principal Investigator |
TAKI Kinji Faculty of Agriculture, Shizuoka University, 農学部, 助手 (00022252)
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| Co-Investigator(Kenkyū-buntansha) |
KAI Yuji Faculty of Agriculture, Shizuoka University, 農学部, 助教授 (60022068)
YOSHIDA Hiroaki Faculty of Agriculture, Shizuoka University, 農学部, 助教授 (10126790)
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| Project Period (FY) |
1987 – 1988
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| Keywords | Water based polymer-isocyanate adhesives / API resin / Crosslinked poly vinyl acetate emulsion adhesives / M-PVAc / Wood adhesives / Crosslinking structure / 動的粘弾性 |
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| Research Abstract |
As new complex-abhesives for wood, water based polymer-isocyanate abhesives and crosslinked poly vinyl acetate emulsion adhesives were sellected. The physical properties of water based polymer-isocyanate adhesives (API) were investigated. Two types of API-resins,namely,poly vinyl alcohol and polystyrene-co-butadiene latex or other latex were used. It was found that both of these API resins exhibited a phase type of network structure on the measurement of their dynamic visco-elastic properties at various temperature levels.The activation energy at the glass transition points of these adhesives increased with increasing amount of isocynanate compound as a crosslinking agent. On the other side, the physical properties of crosslinked poly vinyl acetate emulsion adhesives (M-PVAC) were cleared that these adhesives had a phase of crosslinking structure by addition of the acid-curing agent. Hot resistant during about 80 c was increased.
Two kinds of API-resin adhesives were used to determine the stensile trength of cured resin films and bond strength of wood. The ultimate tensile strength of cured resin films was gratly influenced by the physical properties of adhesive polymers.The curve of the tensile strength of cured films was similar to that of the storage modulus of API-resins. The maximum bond strength of wood lies within the vicinity of the glass transition temperature of these adhesives. The bond strength for M-PVAC adhesives had higher than a commercial poly vinyl acetate emulsion adhesives and less than API adhesives in the range of temperature from 40 C to 100 C.
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