シリコン基板上の多層圧電ダイアフラム構造を用いた高分解能超音波イメージセンサ

• Project/Area Number: 04750375
• Research Category: Grant-in-Aid for Encouragement of Young Scientists (A)
• Allocation Type: Single-year Grants
• Research Field: 電子機器工学
• Research Institution: Chiba University
• Principal Investigator: 橋本 研也 千葉大学, 工学部, 助教授
• Project Period (FY): 1992
• Project Status: Completed (Fiscal Year 1992)
• Budget Amount: ¥1,000,000 (Direct Cost: ¥1,000,000); Fiscal Year 1992: ¥1,000,000 (Direct Cost: ¥1,000,000)