Transien Liquid Phase Bonding of Aluminum Alloy-Based Composites Using Thin Film as Insert Metal
Grant-in-Aid for Scientific Research (C)
|Allocation Type||Single-year Grants|
|Research Institution||Muroran Institute of Technology|
MOMONO Tadashi Muroran Institute of Technology Engineering Associate Professor, 工学部, 助教授 (10002940)
|Project Period (FY)
1995 – 1996
Completed(Fiscal Year 1996)
|Budget Amount *help
¥2,200,000 (Direct Cost : ¥2,200,000)
Fiscal Year 1996 : ¥900,000 (Direct Cost : ¥900,000)
Fiscal Year 1995 : ¥1,300,000 (Direct Cost : ¥1,300,000)
|Keywords||TLP bonding / Insert metal / Diffusion Bonding / Composite / Isothermal solidification / Segregation|
I.Transient Liquid Phase Bonding of Al_2O_3 Particle Reinforced A6061 Alloy-Based Composites Using Copper Thin Film as Insert Metal
1.Copper thin film was oputimal for the insert metal of TLP bonding of the aluminum alloy based composites.
2.Maximum Mechanical properties of joints were obtaind by the following conditions : Cu foil thickness of 0.5-3.0mum, bonding temperature 570ﾟC,bonding time of 0.3ks, and pressure of 1.0MPa.
3.The joint of composites bonded with Cu thin film has been almost the same as the base metal in point of the tensile strength.
4.Tensile strength of the joint were increased by T6 heat treatment after bonding.
5.The segregation of Al_2O_3 particles at the bobd interface were prevented by using thin Cu film.
II.Transient Liquid Phase Bonding of SiC Particle Reinforced AC3A Alloy-Based Composite to AC3A Using Copper Thin Film as Insert Metal
1.Maximum mechanical properties of joints were obtaind by the following conditions : Cu foil thickness of 3.0mum, bonding temperature 560ﾟC,bonding time of 0.6ks, and pressure of 19.6MPa.
2.Coase Si particles were segregated at the bond interface result from coexisting of Al-Cu eutectic liquid phase.
Research Output (3results)