| Project/Area Number |
08650130
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
機械工作・生産工学
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| Research Institution | Kanazawa University |
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Principal Investigator |
KUROBE Toshiji Kanazawa University, FACULTY OF ENGINEERING,PROFESSOR, 工学部, 教授 (60019742)
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| Project Period (FY) |
1996 – 1997
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| Project Status |
Completed (Fiscal Year 1997)
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| Budget Amount *help |
¥2,300,000 (Direct Cost: ¥2,300,000)
Fiscal Year 1997: ¥300,000 (Direct Cost: ¥300,000)
Fiscal Year 1996: ¥2,000,000 (Direct Cost: ¥2,000,000)
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| Keywords | grinding-like polishing / magnetic fluid / magnetic slurry / brittle materials / surface roughness / curved surface |
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| Research Abstract |
A new type of field-assisted fine polishing method for brittle materials has been proposed, which is developed for applying to the polishing on NC grinding machine without the vessel for polishing compound. In this method, the non -contact type polishing is realized with fluid grinding wheel which is covered with thick magnetic fluid film holding the abrasive grain. In this research, the surface polishing experiments are conducted on silicon wafers and polishing characteristics are examined. The following results are obtained : (1) When the clearance between the polisher and the work surface exceeds the definite value, the polishing rate decreases extremely. (2) The use of water based magnetic fluid yields lower polishing rate but smoother surface in comparison with kerosene based magnetic fluid. (3) The surface roughness of polished surface basically depends on grain size and the roughness of the order of nanometers is obtained with fine abrasive grains. (4) The developed polishing method is capable of polishing of plane and curved surfaces. (5) The lapped rough surface can be mirror-finished efficiently by succesive polishing with fine abrasive grains after polishing with coarse grains.
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