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DEVELOPMENT OF HIGHLY RELIABLE LEAD FREE SOLDER

Research Project

Project/Area Number 11555177
Research Category

Grant-in-Aid for Scientific Research (B).

Allocation TypeSingle-year Grants
Section展開研究
Research Field Structural/Functional materials
Research InstitutionSHIBAURA INSTITUTE OF TECHNOLOGY

Principal Investigator

OTSUKA Masahisa  SHIBAURA INSTITUTE OF TECHNOLOGY, MATERIALS SCIENCE AND ENGINEERING, PROFESSOR, 工学部, 教授 (20013732)

Co-Investigator(Kenkyū-buntansha) FUJIWARA Masami  NIHON UNIVERSITY, MECHANICAL ENGINEERING, PROFESSOR, 工学部, 教授 (40156930)
Project Period (FY) 1999 – 2000
Project Status Completed (Fiscal Year 2000)
Budget Amount *help
¥12,400,000 (Direct Cost: ¥12,400,000)
Fiscal Year 2000: ¥4,800,000 (Direct Cost: ¥4,800,000)
Fiscal Year 1999: ¥7,600,000 (Direct Cost: ¥7,600,000)
Keywordslead free solder / mechanical properties / isothermal fatigue / thermal fatigue / Sn-Ag alloy / Cofin-Manson's rule / microjoining / creep / コフィン-マンソン則
Research Abstract

Creep characteristics of Sn-3.5%Ag solder alloys in the as-cast state have been investigated in temperature range between 298K and 398K and creep rate range between 1x10^<-8>s^<-1> and 1x10^<-2>s^<-1> with special reference to the effect of third elements. It is found that Sn-3.5%Ag binary alloy shows power-law creep in which stress exponent (n) is about 10 due to the dispersion strengthening effect of Ag_3 Sn particles. The addition of copper up to 2mass% improves the creep strength of Sn-3.5% Ag binary alloy only slightly both at 298K and at 398K.The addition of bismuth up to 10mass% strengthens it considerably at room temperature through the cooperation of dispersion hardening due to Ag_3 Sn and bismuth phases and solution hardening due to solute bismuth atoms, but degrades it in the low stress regime at 398K principally due to the coarsening of bismuth phase during creep.

Report

(3 results)
  • 2000 Annual Research Report   Final Research Report Summary
  • 1999 Annual Research Report
  • Research Products

    (26 results)

All Other

All Publications (26 results)

  • [Publications] 大塚正久,苅谷義治: "Sn-Ag-Cuソルダの動的強応"溶接学会マイクロ接合委員会資料. No.30. 55-60 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 大塚正久,藁科賢示,苅谷義治,谷本守正: "パラジウムめっきQFP/鉛フリーはんだ接合体の機械的信頼性"ファインプレーティング. No.60. 1-12 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 大塚正久: "鉛フリーはんだの機械特性について"鉛フリーはんだ実用化セミナーテキスト. 1. 33-50 (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 藁科賢示,苅谷義治,谷本守正,大塚正久: "鉛フリーめっきQFPリード/Sn-3.5Ag接合体の熱疲労損傷"Proc.7th Symp.MATE. 1. 429-434 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 森畑智雄,苅谷義治,羽沢栄作,大塚正久: "Sn-3.5%Ag系はんだ合金のクリープ-疲労寿命予測と損傷機構"Proc.7th Symp.MATE. 1. 435-440 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 中村久美子,苅谷義治,田中靖則,中岸豊,大塚正久: "Sn-Ag-Cu系はんだによる無電解Ni-Pめっき被覆銅接合体の強応改善"Proc.7th Symp.MATE. 1. 475-480 (2001)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 苅谷義治,大塚正久: "鉛フリーはんだ技術実践ハンドブック"リアライズ社(東京). 253(75-95) (2000)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] K.Atsumi, Y.Kariya, M.Otsuka: "Microstructure and creep properties of Sn-3.5Ag-xBi and Sn-3.5Ag-xCu Solder Alloys"Proc.10^<th> Symp.Microelectronics. Vol. 1. 183-186 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] T.Morihata, Y.Kariya, E.Hazawa, M.Otsuka: "Creep-Fatigue Damage Mechanism and Lifetime Prediction by Strain Range Partitioning Approach"Proc.10^<th> Symp.Microelectronics. Vol. 1. 175-178 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] K.Nakamura, Y.Kariya, Y.Tanaka, M.Otsuka: "Effect of Copper Addition on Interfacial Microstructure and Strength of Sn-Ag Solder Joint on Electroless Ni-P Film"Proc.10^<th> Symp.Microelectronics. Vol. 1. 179-182 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] K.Nakamura, Y.Kariya, Y.Tanaka, Y.yamagisi, M.Otsuka: "Improvement of Mechanical Strength of Electroless Ni-P Plated Copper Joint through Soldering with Sn-Ag-Cu"Proc.7^<th> Symp.Microjoining and Assembly Technology. vol. 1. 475-480 (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] T.Morihata, Y.Kariya, E.Hazawa, M.Otsuka: "Life Prediction and Damage Mechanism of Creep-Fatigue in Sn-3.5mass%Ag Solder Alloys"Proc.7^<th> Symp.Microjoining and Assembly Technology. vol. 1. 435-440 (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] K.WARASHINA, Y.KARIYA, M.TANIMOTO and M.OTSUKA: "Thermal Fatigue Damage of Lead-Free Solder Plated QFP Leads/Sn-3.5Ag Solder Joints"Proc.7^<th> Symp.Microjoining and Assembly Technology. vol. 1. 429-444 (2001)

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      2000 Final Research Report Summary
  • [Publications] 大塚正久,苅谷義治: "Sn-Ag-Cuソルダの動的強度"溶接学会マイクロ接合委員会資料. No.30. 55-60 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 大塚正久,藁科賀示,苅谷義治,谷本守正: "パラジウムめっきQFP/鉛フリーはんだ接合体の機械的信頼性"ファインプレーティング. NO.60. 1-12 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 大塚正久: "鉛フリーはんだの機械特性について"鉛フリーはんだ実用化セミナーテキスト. 1. 33-50 (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 藁科賢示,苅谷義治,谷本守正,大塚正久: "鉛フリーめっきQFPリード/Sn-3.5Ag接合体の熱疲労損傷"Proc.7th Symp.MATE. 1. 429-434 (2001)

    • Related Report
      2000 Annual Research Report
  • [Publications] 森畑智雄,苅谷義治,羽沢栄作,大塚正久: "Sn-3.5%Ag系はんだ合金のクリープ疲労寿命予測と損傷機構"Proc.7th Symp.MATE. 1. 435-440 (2001)

    • Related Report
      2000 Annual Research Report
  • [Publications] 中村久美子,苅谷義治,田中靖則,中岸豊,大塚正久: "Sn-Ag-Cu系はんだによる無電解Ni-Pめっき被覆銅接合体の強度改善"Proc.7th Symp.MATE. 1. 475-480 (2001)

    • Related Report
      2000 Annual Research Report
  • [Publications] 苅谷義治,大塚正久: "鉛フリーはんだ技術実践ハンドブック"リアライズ社(東京). 253(75-95分担) (2000)

    • Related Report
      2000 Annual Research Report
  • [Publications] 須賀唯知、苅谷義治、大塚正久: "鉛フリーはんだの世界動向とロードマップ"鉛フリーはんだ技術(日刊工業新聞). 第1章. 1-11 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 苅谷義治、大塚正久: "鉛フリーはんだの疲労特性"鉛フリーはんだ技術(日刊工業新聞). 第5章. 83-96 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 苅谷義治、大塚正久: "鉛フリーはんだの熱疲労・耐食性"鉛フリーはんだ技術(日刊工業新聞). 第6章. 97-109 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] 藤原雅美、大塚正久: "マイクロインデンテーションによるBS*単結晶の高温クリープ"日本金属学会誌. 63・6. 760-769 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] Kariya,Otsuka 他2名: "Effect of Additional Element on the Thermal FaAcgul."Adv.in Electron.Pachagiry(ASMZ). 26-1. 173-180 (1999)

    • Related Report
      1999 Annual Research Report
  • [Publications] Kariya,Hirata,Otsuka: "Effect of Thernal Cycles on the Mecharial Strength"J.Electronic Materials(TUS). 28・11. 1261-1267 (1999)

    • Related Report
      1999 Annual Research Report

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Published: 1999-04-01   Modified: 2016-04-21  

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